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Gels, Encapsulants and Conformal Coatings
Reliable electronics protection
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Gels, Encapsulants and Conformal Coatings
Superior protection, superior performance
Discover how silicones revolutionize electronic component protection. Renowned for their unparalleled thermal stability, electrical insulation, and resistance to moisture and contaminants, silicones offer a robust shield for sensitive electronic devices. With flexibility and ease of application, silicones conform to various component geometries, ensuring comprehensive protection in diverse environments. Explore our solutions to safeguard your electronic components with confidence.
Ensuring durability and reliability for your electronic components
Conformal coatings provide a protective barrier for electronic components, shielding them from environmental threats such as moisture, dust, and chemicals. By enhancing the durability and reliability of circuit boards, these coatings ensure optimal performance and longevity of your electronic devices.
Moisture/Heat Cure Conformal Coatings
Moisture and heat cure conformal coatings offer robust protection for electronic components by forming a durable barrier that cures in the presence of moisture or elevated temperatures. These coatings are particularly effective in harsh environments, ensuring that circuit boards remain safeguarded against moisture ingress, thermal stress, and other environmental challenges, thereby enhancing the reliability and longevity of electronic devices.
Featured moisture/heat cure conformal coatings
DOWSIL™ 1-2577 Conformal Coating
One-part, transparent, moisture cure conformal coating intended for use in printed circuit board assemblies (PCBA). DOWSIL™ 1-2577 Conformal Coating is a medium viscosity, abrasion resistant, solvent borne coating that is UL, IPC, and MIL recognized.
DOWSIL™ 3-1953 Conformal Coating
One-part, translucent, moisture cure conformal coating intended for use in printed circuit board assemblies (PCBA). DOWSIL™ 3-1953 Conformal Coating is a low viscosity, stress relieving, no solvent added coating that is UL, IPC, and MIL recognized.
DOWSIL™ 1-4105 Conformal Coating
One-part, transparent, heat cure conformal coating intended for use in printed circuit board assemblies (PCBA). DOWSIL™ 1-4105 Conformal Coating is a low viscosity, stress relieving, no solvent added coating that is UL, IPC, and MIL recognized.
Introducing DOWSIL™ CC-8000 Series UV and Dual Moisture Cure Conformal Coatings
DOWSIL™ CC-8000 Series UV and Dual Moisture Cure Conformal Coatings are exceptional silicone coatings that cure in seconds with broad spectrum UV or LED light, and span the range of low-to-high viscosities, enabling strong protection in a wide range of applications. This family of products is robust enough to protect even the most sensitive electronics components and is solventless ― enabling an eco-friendly environment for workers.
We’ve got you covered
DOWSIL™ CC-8000 Series Conformal Coatings come in a range of viscosities to help you meet all of your processing and application demands. Ideal for stability in harsh conditions, this award-winning product family provides excellent protection in highly humid environments and against contamination, and excellent flame retardancy and electrical properties. Offered in low-, medium-, and high-viscosity options, these coatings are suitable for the most sensitive electronic components in varied applications.
DOWSIL™ CC-8030 Conformal Coating
One-part, translucent, low viscosity, conformal coating with primary UV or LED curing and secondary moisture cure for shadow regions. Our low-viscosity silicone coatings support high-speed production methods, including manual or automated spraying, flow, or jetting techniques. These faster flowing materials are also suitable options when you want your coating to flow through vias or under chips. "Photo courtesy of ASYMTEK Products | Nordson Electronics Solutions"
DOWSIL™ CC-8033 Conformal Coating
One-part, translucent, medium viscosity, conformal coating with primary UV or LED curing and secondary moisture cure for shadow regions. Our medium-viscosity silicone coatings support high-speed production methods, including manual or automated spraying, flow, or jetting techniques as well as needle dispensing for damming or keep out regions or where thicker coating protection is required.
DOWSIL™ CC-8036 Conformal Coating
One-part, translucent, high viscosity, conformal coating with primary UV or LED curing and secondary moisture cure for shadow regions. Our high viscosity silicone coatings provide options to increase control over the speed and distance of flow, to prevent their spread into "keep out" areas. Our higher viscosity coatings also enables thicker coating layers in one pass.
Stability, protection, and increased throughput
These one-part, translucent, conformal coatings with primary UV or LED curing and secondary moisture cure for shadow regions come in low, medium, and high viscosity. These viscosity variations offer full customization for your coating needs from spraying, to needle dispensing, or a combination of both for damn and fill. Look at these various coatings in action.
DOWSIL™ CC-8030 Conformal Coating Spray
CC-8030 is a low viscosity conformal coating designed specifically for spray coating.
DOWSIL™ CC-8033 Conformal Coating for Dam and Fill
CC-8033 is a medium viscosity conformal coating that can be sprayed and/or needle dispensed.
DOWSIL™ CC-8036 Conformal Coating Needle Dispense
CC-8036 is a high viscosity conformal coating that can be needle dispensed.
DOWSIL™ CC-8036 Conformal Coating Needle Dispense and DOWSIL™ CC-8033 Conformal Coating Spray
All DOWSIL™ CC-8000 series conformal coating are compatible with each other allowing different materials to be sprayed or dispensed and cured at the same time.
Gels
Shielding sensitive electronic components against harsh conditions is critical to ensuring reliable performance – whether targeting applications for extreme military or industrial use, automotive, computing or communications. Silicone gels help improve the reliability and performance of complex or extremely delicate electronic components even in the most demanding environments.
Featured gels
SYLGARD™ 527 A&B Silicone Dielectric Gel
Two-part, 1:1 mix ratio, transparent, room temperature or heat-accelerated cure gel intended for use in potting printed circuit board (PCB) system assemblies. SYLGARD™ 527 A&B Silicone Dielectric Gel is a low viscosity, very soft gel that is suitable for delicate components.
DOWSIL™ EG-3896 Kit
Two-part, 1:1 mix ratio, translucent, heat-accelerated cure gel intended for use in potting printed circuit board (PCB) system assemblies. DOWSIL™ EG-3896 Kit is a low viscosity, very soft gel with an extended operational temperature from -40°C - 185°C.
DOWSIL™ 3-4207 Dielectric Tough Gel Kit
Two-part, 1:1 mix ratio, translucent green, room temperature or heat-accelerated cure gel intended for use in potting printed circuit board (PCB) system assemblies. DOWSIL™ 3-4207 Dielectric Tough Gel Kit is a low viscosity, tough gel with conditional primerless adhesion and good flame resistance.
Encapsulants
Silicone encapsulants are essential for ensuring reliable performance in electronic applications. These materials provide long-term reliability and help reduce lifetime costs for various electronic designs. With excellent flexibility, high dielectric strength, and resistance to moisture and chemicals, silicone encapsulants are an ideal choice for enhancing the durability and efficiency of electronic components.
Featured encapsulants
SYLGARD™ 184 Silicone Elastomer Kit
Two-part, 10:1 mix ratio, transparent, room temperature or heat-accelerated cure elastomer intended for use in potting printed circuit board (PCB) system assemblies, power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs and relays. SYLGARD™ 184 Silicone Elastomer Kit is a medium viscosity, firm elastomer that is UL recognized. Faster cure version of SYLGARD™ 182 Silicone Elastomer Kit.
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Two-part, 1:1 mix ratio, dark gray, room temperature or heat-accelerated cure encapsulant intended for use in potting printed circuit board (PCB) system assemblies. DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a medium viscosity, soft encapsulant with moderate thermal conductivity.
SYLGARD™ 567 Primerless Silicone Encapsulant Kit
Two-part, 1:1 mix ratio, black, heat-accelerated cure encapsulant intended for use in potting printed circuit board (PCB) system assemblies. SYLGARD™ 567 Primerless Silicone Encapsulant Kit is a medium viscosity, firm encapsulant with primerless adhesion.
Additional resources
Conformal Coating Selection Guide . Find the right conformal coating for your application.
Gels and Encapsulants Selection Guide. Find the right gel or encapsulant for your application.
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What are inhibitors for platinum-catalyzed addition-cure silicones?
- Amines and amides: – Neutralizing amines – Ethanolamine
- N-methylethanolamine, triethanolamine
- N,N-dimethyl ethanolamine, n-butylamine, diethylamine – Triethylamine, tetramethylenediamine, cyclohexylamine
- Melamine – Dimethylformamide
- Nitriles, cyanates, oximo, nitroso, hydrazo, azo compounds: – Adiponitrile – 2-butoxime – Alpha-nitroso-beta-naphthol
- Chelates: – EDTA (ethylenediaminetetraacetic acid) – NTA (nitriloacetic acid)
- Sulfides, thio compounds: – Dibenzyldisulfide, thioacetic acid, allylthiourea
- Fatty acid tin salts, such as those used in tin-catalyzed silicone release coatings
- Phosphines: – Triphenylphosphine
- Phosphites: – Triethylphosphite
- Arsines, stibenes, selenide, telluride:
- Triphenylarsine, triphenylstibene
- P-chlorophenylcarboxymethylselenide
- Chlorinated hydrocarbons that contain amine stabilizers
- Alcohols: – Ethanol, methanol
- Esters: – Ethyl acetate, vinyl acetate
- Compounds with unsaturated bonds
- Nonchlorinated aromatic and aliphatic solvents: – Toluene, xylene – Hexane, mineral spirits
- Polyethylene that has an anti-slip, antioxidant or other additive listed previously
- Primers with pigments that contain compounds listed previously
- 100% sodium salt primers, such as sodium alginate or carboxymethylcellulose sodium salt however, if these salts are used with hydroxyethylcellulose, inhibition will not occur
- Clay coatings that use polyvinylacetate or acrylic latex as a binder
- Coatings that contain calcium carbonate
- Coatings composed of the following combinations:
- Natural rubber latex/clay; latex/ethylated starch
- Styrene/acrylic
- Polyvinylacetate; polyvinylacetate/acrylic
- Polyvinylalcohol; polyvinylalcohol/alginate
- Ethylcellulose; hydroxyethylcellulose/alginate; hydroxyethylcellulose/carboxymethylcellulose
- Clay/S.B.R. coatings
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