Data Center Cooling
Data Center Cooling
As the future of communications depends on reliable cloud and data centers, there are growing challenges in efficiency and sustainability. At Dow, we provide a wide range of heat transfer fluids and cooling solutions to help data centers save energy, reduce costs and improve performance.
The continual advancement of micro-processor technology to support Artificial Intelligence (AI), the Internet-of-Things, and the overall acceleration of digital platforms has led to increasingly higher heat loads incurred by Datacom Equipment Cooling Systems (DECS).
DOWFROST™ LC Heat Transfer Fluid is a propylene glycol-based fluid specifically formulated for liquid cooled, direct-to-chip applications and provides data center systems with exceptional corrosion protection, even in high surface area copper components. It is used in these systems to provide freeze protection and limit corrosion to ensure long life of the system.
With the continual advancements of micro-processor technology, leading to increasingly higher heat loads, DOWFROST™ LC is the optimal fluid for efficient heat removal in Datacom Equipment Cooling Systems (DECS). With a customized inhibitor package, DOWFROST™ LC provides superior corrosion protection for liquid cooled, direct-to-chip applications with high surface area copper components.
DOWSIL™ Immersion Cooling Technology is a gamechanger for cooling cloud and data centers. This innovation immerses servers into non-conductive liquid. The thermal energy generated from the hardware transfers into the DOWSIL™ fluid in a single-phase process – electronics are cooled, space is saved, and energy costs are reduced. DOWSIL™ Immersion Cooling Technology delivers optimal cooling and thermal conductivity that is heat-resistant and non-flammable liquid.
See how Dow is changing the game for cooling cloud and data centers while also saving space and reducing energy costs.
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