DOWSIL™ TC-5026 Thermally Conductive Compound
Designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles.
Uses:
- DOWSIL™ TC-5026 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles
Benefits:
- Solventless formulation
- Flowable
- Non-curing – no need for curing ovens
- Capable of achieving thin Bond Line Thickness for optimum performance
- Very low thermal resistance
- High thermal conductivity
- Conducts heat away from sensitive components
Properties
These values are not intended for use in preparing specifications.
Physical Properties
- Color Yes No Grey
- Dielectric Strength Yes No 227 volts per mil v/mil
- Flowable Yes No Yes
- Non-curing Yes No Yes
- Shelf Life Yes No 712 Days
- Specific Gravity Yes No 3.5
- Thermal Conductivity Yes No 2.9 W/m・K
- Thermal Resistance at 40 psi Yes No 0.03 Deg C-cm2/W
- Viscosity Yes No 100000 mPa.s
- Volume Resistivity Yes No 5.9e+011 Ω・cm
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
No sales specification could be found for this material in selected language
The following Rules apply:
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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