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Conductive Materials

Less Heat, More Reliability

Drawing out heat to enhance the performance and reliability of electronics

Heat and stress are enemies of today’s electronics, but thermally and electrically conductive materials can help you win the battle and enhance reliability for even the most sensitive electronic applications.

Thermally conductive materials

Conductive materials are available as adhesives, compounds, encapsulants, gels, thermal pads and gap fillers. All of these materials are available in a wide range of delivery formats, viscosities, cure chemistries, and thermal and mechanical properties to help draw out heat in a broad variety of industries and applications:

  • Transportation – enabling higher performance and more cost-effective thermal management for vehicles that are increasingly reliant on PCB system assemblies
  • Solid state lighting – offering thermal management options for LED modules that have a direct impact on reliability, output quality, and lifetime and system costs of these innovative and energy-efficient lighting products
  • Consumer devices and telecommunications – providing thermal management solutions for thin-profile and compact designs as the trend continues toward smaller devices with more densely packed components
  • Power devices – enabling improved thermal management as power supply devices and controls for industry, computer servers, and solar and wind energy are all managing higher electrical loads

Electrically conductive materials

Electrically conductive materials combine exceptional mechanical and conductive properties with strong EMI shielding for today’s most demanding applications in these markets:

  • Transportation – meeting industry needs as the electrification of vehicles drives demand for compliance with tight safety regulations, reliability and greater connectivity
  • Telecommunications – offering solutions for 5G base stations and optical interconnects that need greater data transfer at faster speeds
  • Consumer devices – providing solutions for high-density packaging and smart architectures that are susceptible to electronic pollution, which can disrupt or disable circuits


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