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Conductive Materials
Reliable Electronics Protection
Explore
Conductive Materials
Superior protection, superior performance
Discover how silicones revolutionize electronic component protection. Renowned for their unparalleled thermal stability, electrical insulation, and resistance to moisture and contaminants, silicones offer a robust shield for sensitive electronic devices. With flexibility and ease of application, silicones conform to various component geometries, ensuring comprehensive protection in diverse environments. Explore our solutions to safeguard your electronic components with confidence.
For powerful protection from heat
Thermally conductive silicones from Dow come in a wide range of viscosities, cure speeds and delivery systems to address the growing need for higher-performance and more cost-effective thermal management in electronics designs for virtually every industry.
Gap Fillers
Thermally conductive gap fillers are easy-to-use, soft, compressible, stress-relieving and vibration-damping materials with minimal process preparation requirements. They offer excellent long-term durability in application, maintain low-stress interfacial contact and feature thixotropic characteristics benefiting processability and vertical hold stability. Gap fillers are an excellent choice for applications with large gap tolerances (typically 150 μm to 2 mm).
Featured thermally conductive gap fillers and gels
DOWSIL™ TC-4060 Thermal Gel
Two-part, blue, 6.0 W/mK thermally conductive gap filler formulated to dissipate heat in electronics applications, such as telecom power supplies, high frequency devices (5G), and electronic control units (ECU). DOWSIL™ TC-4060 Thermal Gel is a rapid dispense product, intended for high throughput applications.
DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
Two-part, blue, 3.4 W/mK thermally conductive gap filler formulated to dissipate heat in electronics applications, such as engine modules, transmission control units, and power electronics. DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler features thixotropic characteristics that benefits processability and vertical hold stability.
DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
Two-part, blue, 2.5 W/mK thermally conductive gap filler formulated to dissipate heat in electronics applications, such as engine modules, transmission control units, and power electronics. DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler features thixotropic characteristics that benefits processability and vertical hold stability.
Adhesives
Thermally conductive adhesives are suitable for bonding and sealing hybrid circuit substrates, semiconductor components, heat spreaders and other applications that demand broad design, flexible processing options and excellent thermal management. One-part moisture-cure grades offer simple room-temperature processing to minimize costs. One or two-part heat cure solutions help to accelerate processing to speed time to market.
Featured thermally conductive adhesives
DOWSIL™ TC-2022 Thermally Conductive Adhesive
One-part, gray, 1.7 W/mK thermally conductive adhesive formulated for sealing and bonding components in electronics applications, such as integrated circuit substrates, heat sinks, and engine control units (ECU). DOWSIL™ TC-2022 Thermally Conductive Adhesive is a heat cure product with rapid cure and high tensile strength.
DOWSIL™ SE 4485 Thermally Conductive Adhesive
One-part, white, 2.8 W/mK thermally conductive adhesive formulated for sealing and bonding components in electronics applications, such as telecommunication devices and power supply modules. DOWSIL™ SE 4485 Thermally Conductive Adhesive is a room temperature cure product with good adhesion and a fast tack-free time.
DOWSIL™ TC-2035 CV Adhesive
Two-part, reddish brown, 3.3 W/mK thermally conductive adhesive formulated for sealing and bonding components in electronics applications, such as electronic control units, heat sinks, and power electronics. DOWSIL™ TC-2035 CV Adhesive is a heat cure product designed for fast manufacturing cycle times, smooth dispense, and durable adhesion.
Compounds (greases)
Thermally conductive compounds, commonly called greases, serve as a thermal bridge drawing heat away from a device’s sensitive electronic components and dissipates it into the ambient environment. These no-cure materials offer relatively low cost and, ease of application on heat sinks via screen printing and ease of rework.
Featured thermally conductive compounds
DOWSIL™ TC-5888 Thermally Conductive Compound
One-part, gray, 5.2 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, such as microprocessor units (MPU) and power modules. DOWSIL™ TC-5888 Thermally Conductive Compound is non-curing, with low thermal resistance.
DOWSIL™ TC-5960 Thermally Conductive Compound
One-part, gray, 6.0 W/mK thermally conductive compound formulated to dissipate heat in bare die electronics applications. DOWSIL™ TC-5960 Thermally Conductive Compound is non-curing, with low thermal resistance.
DOWSIL™ TC-5628 Thermal Compound
One-part, blue, 4.0 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, such as bare die, insulated-gate bipolar transistors (IGBT), and electric vechiles (EV). DOWSIL™ TC-5628 Thermal Compound exhibits a latent cure in application after reaching 60 °C.
Encapsulants (pottants)
Thermally conductive encapsulants and gels come in a wide range of adaptable products for encapsulation and potting applications. The low viscosity before cure of these products enables them to process easily and fully embed tall components, delicate wires and solder joints. They are particularly suitable for managing high heat in complicated electronic module component architectures.
Our dispensable thermal pads enable you to quickly and precisely dispense or print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes, helping to ensure excellent thermal management and lower cost of ownership compared to prefabricated thermal pads.
Featured thermally conductive encapsulants
DOWSIL™ TC-6040 Thermal Conductive Encapsulant
Two-part, pink, 4.0 W/mK thermally conductive encapsulant formulated to encapsulate and dissipate heat in electronics applications, such as on-board chargers (OBC), DC/DC converters for electric vehicles (EV), and other power electronics. DOWSIL™ TC-6040 Thermal Conductive Encapsulant is a heat cure product with good flowability.
DOWSIL™ TC-6032 Thermally Conductive Encapsulant
Two-part, blue, 3.2 W/mK thermally conductive encapsulant formulated to encapsulate and dissipate heat in electronics applications, such as on-board chargers (OBC), DC/DC converters, and inductors/transformers for electric vehicles (EV). DOWSIL™ TC-6032 Thermally Conductive Encapsulant is a heat cure product with good flowability.
DOWSIL™ TC-6010 Thermally Conductive Encapsulant
Two-part, blue, 1.2 W/mK thermally conductive encapsulant formulated to encapsulate and dissipate heat in electronics applications, such as on-board charger (OBC), electric vehicle (EV) power electronics, and EV battery. DOWSIL™ TC-6010 Thermally Conductive Encapsulant is a highly flowable heat cure product.
Gels
Thermal Gels are user-friendly materials that are soft, compressible, and effective in relieving stress and damping vibrations. They require minimal preparation and offer excellent long-term durability in applications. These gels maintain low-stress interfacial contact and have thixotropic properties, which enhance processability and vertical hold stability. They are an ideal choice for applications with variable gap tolerances, typically ranging from 40 μm to 2 mm.
Featured thermally conductive gels
DOWSIL™ TC-3035 Reworkable Thermal Gel
One-part, pink, 4.0 W/mK thermally conductive gel formulated to dissipate heat in electronics applications, such as smart phones, infotainment, and advanced driver assistance systems (ADAS). DOWSIL™ TC-3035 Re-workable Thermal Gel is a reworkable, room temperature cure product with accelerated heat cure.
DOWSIL™ TC-3065 Thermal Gel
One-part, gray, 6.5 W/mK thermally conductive gel formulated to dissipate heat in electronics applications, such as telecom devices, datacom equipment, and printed circuit board (PCB) assemblies. DOWSIL™ TC-3065 Thermal Gel is a reworkable, room temperature cure product with accelerated heat cure.
DOWSIL™ TC-3080 Curable Thermal Gel
One-part, 7.0 W/mk thermally conductive ultra soft gel formulated to dissipate heat in electronics applications, such as arrayed power chips, 5G, autonomous vehicles, and telecommunications. DOWSIL™ TC-3080 Curable Thermal Gel is a room temperature cure product with accelerated heat cure that is ultra soft and has a long working time.
Adhesives
Electrically conductive adhesives and EMI shielding materials are based on highly tunable silicone technology that conducts electricity while blocking electromagnetic interference in applications that require high density packaging and/or high rates of data transfer. They meet a critical and growing need in IoT consumer devices, self-driving and ADAS automotive systems and 5G communications equipment.
Featured electrically conductive adhesives
DOWSIL™ EC-6601 Electrically Conductive Adhesive
Electrically conductive adhesive with high shielding effectiveness and durable mechanical / conductive properties for radar, cameras, and 5G base stations.
DOWSIL™ EC-8425 Electrically Conductive Adhesive
An electrically conductive adhesive for grounding, bonding and shielding interference applications with durable mechanical and conductive properties and reliable performance at high temperature and vibration.
DOWSIL™ ME-1800 Adhesive
One-part, gray, 6.8 W/mK thermally conductive adhesive formulated for sealing and bonding components in electronics applications, such as grounding, die attach, and microelectronics. DOWSIL™ ME-1800 Adhesive is a heat cure product with high thermal and electrical conductivity.
DOWSIL™ EC-6601 Electrically Conductive Adhesive
Protect electronic applications against electromagnetic interference across a wide range of frequencies.
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