Conductive Materials

Less heat, more reliability

For powerful protection from heat

Protect electronics with our innovative thermally conductive heat transfer materials. Available in various viscosities, cure speeds, and delivery systems, our thermal management materials help enhance component reliability and lifespans for even the most sensitive electronics applications.

Whether you need conductive adhesives, encapsulants, gels, thermal pads or gap fillers, our thermally conductive compounds and materials effectively transfer heat to keep technology performing its best.

Conductive materials are available as adhesives, compounds, encapsulants, gels, thermal pads and gap fillers. All of these are available in a range of delivery formats, viscosities, cure chemistries, and thermal and mechanical properties to help draw out heat in a variety of industries and applications:

DOWSIL™ TC-2035 Adhesive Thermally Conductive Adhesive

Adhesives

Thermally conductive adhesives are suitable for bonding and sealing hybrid circuit substrates, semiconductor components, heat spreaders and other applications that demand broad design, flexible processing options and excellent thermal management. One part moisture-cure grades offer simple room-temperature processing to minimize costs. One or two-art heat cure solutions help to accelerate processing to speed time to market.  

Circuit board with 240 heat sink compound applied.

Compounds/ Greases

Thermally conductive compounds, commonly called greases, serve as a thermal bridge that draws heat away from a device’s sensitive electronic components and dissipates it into the ambient environment. These no-cure materials offer relatively low cost, ease of application on heat sinks via screen rating and ease of rework.  

Demonstration of dispensing and flowability of DOWSIL™ TC-6032 Thermally Conductive Encapsulant

Encapsulants

Thermally conductive encapsulants and gels come in a wide range of adaptable products for encapsulation and potting applications. The low viscosity before cure of these products enables them to process easily and fully embed tall components, delicate wires and solder joints. They are particularly suitable for managing high heat in complicated electronic module component architectures.

Our dispensable thermal pads enable you to quickly and precisely dispense or print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes, helping to ensure excellent thermal management and lower cost of ownership compared to prefabricated thermal pads. 

Automotive control unit rendering

Gap Fillers

Thermally conductive gap fillers are easy-to-use, soft, compressible, stress-relieving and vibration-damping materials with minimal process preparation requirements. They offer excellent long-term durability in application, maintain low-stress interfacial contact and feature thixotropic characteristics that benefit processability and vertical hold stability. Gap fillers are an excellent choice for applications with large gap tolerances (typically 150 μm to 2 mm).

Close-up view of Carbice's thermal interface material

Reliable thermal management powered by Dow silicones and Carbice carbon nanotubes

Dow Corning EA-7100 Adhesive for electronics

Adhesives

Electrically conductive adhesives and EMI shielding materials are based on highly tunable silicone technology that conducts electricity while blocking electromagnetic interference in applications that require high density packaging and/or high rates of data transfer. They meet a critical and growing need in IoT consumer devices, self-driving and ADAS automotive systems and 5G communications equipment. 

close up beautiful nano electronic technology board

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Close-up view of Carbice's thermal interface material

Reliable thermal management powered by Dow silicones and Carbice carbon nanotubes.

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