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Electronics

Value Chain Solutions

Making a material difference in electronics applications

Designers and manufacturers from many industries are facing new challenges as they develop next-generation products while working to fulfill evolving consumer needs. With a broad portfolio of electronics materials and global technical expertise, we are ready to deliver on today’s needs and collaborate with you on tomorrow’s challenges. Together we can help you achieve faster processing, higher purity, higher conductivity and more sustainable solutions across the entire electronics value chain.  

  • Semiconductor, novel display and printed circuit board applications: Providing high purity, low metal, consistent quality solvents, amines, chelants, and surfactants for photo resist, color resist, etchant, stripper and thinner applications 
  • Silicone solutions for display applications: Offering optically clear silicone resins (OCRs), including UV cure and other cure systems for displays, silicone thermal conductives for heat management in displays, as well as materials for assembly and protection  
  • Electronic and advanced modules/systems applications: Delivering solutions for electronic modules, sensors and components used across segments in the electronics industry – including silicone and polyurethane sealants, adhesives, thermal and electrical conductives, electromagnetic interference (EMI) conductives, conformal coatings, gels and encapsulants that protect against heat, moisture, contamination and vibration 
  • Energy applications: Delivering heat transfer and cooling fluids to protect a wide variety of electronics from damaging heat 
  • Printed circuit board assemblies: Delivering an industry leading line of gels and pottants, thermally conductive materials, optically clear materials, conformal coatings and encapsulants to enable compact devices and help draw heat away from sensitive components 
  • Battery and e-mobility applications: Providing cathode, anode, slurry, coatings, electrolyte, thermally conductive interface materials, foams, gels, and assembly materials like adhesives or sealants for battery, inverter, electric motor, on-board charger and other applications

 

 

Latest Product Innovations: Electronics

Foldable device

DOWSIL™ VE-8001 Flexible Silicone Adhesive

Two-part elastic hinge adhesive solution for flexible OLED display applications in foldable and rollable consumer devices.

July 2020

Blowout of automotive display module

DOWSIL™ VE-6001 UV-T Optical Bonding

One-part bonding material for automotive displays requiring high-reliability in harsh environments.

June 2019

Radar blowout

DOWSIL™ EC-6601 Electrically Conductive Adhesive

One-part moisture cure electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC).

May 2019

Conformal coating designed for rapid in-line processing

DOWSIL™ CC-8030 UV and Dual Moisture Cure Conformal Coating

One-part, translucent, medium viscosity, UV and moisture dual curable coating.

February 2020

Server Room with server towers

DOWSIL™ ICL-1000 Fluid

Immersing the cloud in sustainability with an innovative silicone liquid engineered to meet the demands of a dielectric coolant for immersion or spray cooling of data center servers.

February 2023

Multiphase power system modern processor with heatsink and the CPU socket

DOWSIL™ TC-5628 Thermal Compound

Designed to maintain positive heat sink contact to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.

February 2023

Close-up view of a modern GPU card with circuit and colorful lights and details

DOWSIL™ TC-5550 Thermal Conductive Compound

Created for the materials challenges in next-generation electronics technology. This silicone grease can be used in place of a PCM or thermal pad and was designed for bare die and lidless GPUs.

February 2023

mobile phone close up

DOWSIL™ TC-3035 S Thermal Gel

Provides next-level cooling in high-performance electronics while delivering 4W/mK thermal conductivity, decreases chip temperature and improves power chip working efficiency.

February 2023

Thermal paste applied to circuit board

DOWSIL™ TC-6015 Thermal Conductive Encapsulant

Developed to meet the demand across industries including renewable energy, energy storage, new energy vehicles and 5G stations for higher thermal conductivity materials.

February 2023

Telecommunication tower with 5G cellular network antenna on city background

DOWSIL™ TC-4083 Dispensable Thermal Pad

A 2-part thermal conductive gap filling gel providing excellent reliability and vertical stability after harsh aging testing to meet the demands of 5G technology and the environment.

February 2023

Thermal gel auto-dispensing

DOWSIL™ TC-3065 Thermal Gel

A one-part, heat cure silicone based thermally conductive gel with good re-workability and low volatile content that helps enable 5G technology to function and contributes to sustainability.

July 2020

Thermal gel applied to circuit board

DOWSIL™ TC-3015 Thermal Gel

Dow’s latest patented gel offers thermal management of central processing units in smartphones and other assemblies.

August 2018

 

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