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MEMS Sensors and Actuator Solutions

Micro electric-mechanical system sensors and actuators

MEMS Sensors and Actuator Solutions

Silicone solutions for MEMS and advanced semiconductors

As microelectronics become ever smaller, thinner and more complex, requirements for stress management, durability and reliability grow more challenging.

 

Dow silicone hybrids, hotmelts and die-attach film solutions can help optimize designs for MEMS and advanced semiconductor packaging, drive new innovations and meet stringent performance requirements, including thermal stress relaxation, stability over broad temperature and frequency ranges, low moisture uptake, high purity and reliability. Dow’s silicone-based materials address all these needs more effectively than organics such as epoxies and polyurethanes.

Optimize designs for MEMS and advanced semiconductor packaging 

Drive new innovations and meet stringent performance requirements 

Address needs more effectively than organics such as epoxies and polyurethanes

Dow’s newest silicone solutions for MEMS and semiconductor packaging

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Die Attach Film

Die-attach films, are cured silicone films, offering excellent uniformity for precise thickness and eliminating fillets and bleed-out that commonly occur with epoxy adhesives. Die-attach applications target for typical semiconductor package, especially for MEMS sensors.

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Novel Silicone Hybrid Adhesives

Silicone hybrid adhesives combine silicone and organics in a unique formulation, delivering enhanced mechanical properties that silicone alone can’t achieve, such as higher modulus and strong adhesion to various surfaces. They also feature excellent optical properties and non-yellowing for light post to reliability for light module applications.

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Silicone Hotmelt

Silicone hot melt, offered in film, cartridge and tablet formats, provide excellent adhesion to a variety of substrates, as well as stress relief for warpage mitigation. Excellent for semiconductor processing as mold-underfill, soft mold and encapsulation.

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Silicone hybrids, hotmelts and die-attach film solutions

Explore our portfolio of silicone hybrids, hotmelts and die-attach film solutions for MEMS and advanced semiconductor packaging.

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Sensing the market growth of MEMS sensors and calculators

Enhance design and performance by discovering the growth of MEMS sensors and actuators.

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DOWSIL™ Silicone Hot-Melt Film Technology

Learn about the advantages of DOWSIL™ Silicone Hot-Melt Film vs. liquid silicone, including a quicker, easier process and reduced thermal stress.

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DOWSIL™ Silicone Hot-Melt Cartridge Technology

Discover why DOWSIL™ Silicone Hot-Melt Cartridge for compression molding provides better workability and thermal stability vs. liquid silicone for chip encapsulation and soft molding.

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