Silicone Solutions for MEMS and Advanced Semiconductor Packaging
As microelectronics become ever smaller, thinner and more complex, requirements for stress management, durability and reliability grow more challenging.
Dow silicone hybrids, hotmelts and die-attach film solutions can help optimize designs for MEMS and advanced semiconductor packaging, drive new innovations and meet stringent performance requirements, including thermal stress relaxation, stability over broad temperature and frequency ranges, low moisture uptake, high purity and reliability. Dow’s silicone-based materials address all these needs more effectively than organics such as epoxies and polyurethanes.
Dow’s newest silicone solutions for MEMS and semiconductor packaging
Die-attach films, which are cured silicone films, offer excellent uniformity for precise thickness and eliminate fillets and bleed-out that commonly occur with epoxy adhesives. Die-attach applications target for typical semiconductor package, especially for MEMS sensors.
Silicone hybrid adhesives combine silicone and organics in a unique formulation. They deliver enhanced mechanical properties that silicone alone can’t achieve, such as higher modulus and strong adhesion to various surfaces. They also feature excellent optical properties. Non-yellowing for light post to reliability for light module applications.
Silicone hot melt, offered in film, cartridge and tablet formats, provide excellent adhesion to a variety of substrates, as well as stress relief for warpage mitigation. Excellent for semiconductor processing as mold-underfill, soft mold and encapsulation.
DOWSIL™ SiliconeHot-Melt Film Technology
Learn about the advantages of DOWSIL™ Silicone Hot-Melt Film vs. liquid silicone, including a quicker, easier process and reduced thermal stress
DOWSIL™ Silicone Hot-Melt Cartridge Technology
Discover why DOWSIL™ Silicone Hot-Melt Cartridge for compression molding provides better workability and thermal stability vs. liquid silicone for chip encapsulation and soft molding