Properties
Typical Properties |
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| Material Type | Compounds and Greases |
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DOWSIL™ TC-5960 Thermally Conductive Compound
Overview
Properties
Technical Content
Sample Options
What is DOWSIL™ TC-5960 Thermally Conductive Compound?
One-part, gray, 6.0 W/mK thermally conductive compound formulated to dissipate heat in bare die electronics applications. DOWSIL™ TC-5960 Thermally Conductive Compound is non-curing, with low thermal resistance.
Uses
- Minimizing thermal resistance
- Thermal interface material (TIM)
Benefits
- Thermal conductivity: 6.0 W/mK
- Thermal resistance: 0.03 °C-cm2/W @ 16 µm gap
- Excellent pump-out resistance for bare die application
- High thixotropy – index of 9
- One-part material – no cure required
- Solvent-free formulation – offers material stability
- Easy application – screen- and stencil-printable
Overview and features of DOWSIL™ TIM1.5 Thermally Conductive Compounds
These innovative silicone greases can be used in place of PCMS or thermal pads and print right onto the product, generating less waste.
Materials Training
These videos explain the importance of heat protection in electronics, introduce five types of thermally conductive materials, demonstrate handling and dispensing methods, and offer tips for choosing the best Dow silicone solutions for optimal thermal management.
Overview of thermal materials and their roles in electronic heat management.
Overview of dispensing, curing, packaging, and storage of thermal materials.
Overview of common challenges and practical tips when handling thermal materials.
Overview of leading products, selection guides and application examples.
Overview of common application questions and technical review.