Latest Product Innovations in Electronics Market | Dow Inc.

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Welcome to our Electronics product launch page

Here you will find information on our most recently launched innovations for electronics and systems assembly applications.

Foldable device

DOWSIL™ VE-8001 Flexible Silicone Adhesive

Two-part elastic hinge adhesive solution for flexible OLED display applications in foldable and rollable consumer devices.

July 2020

Thermal gel auto-dispensing

DOWSIL™ TC-3065 Thermal Gel

A one-part, heat cure silicone based thermally conductive gel with good re-workability and low volatile content that helps enable 5G technology to function and contributes to sustainability.

July 2020

Conformal coating designed for rapid in-line processing

DOWSIL™ CC-8030 UV and Dual Moisture Cure Conformal Coating

One-part, translucent, medium viscosity, UV and moisture dual curable coating

February 2020

Blowout of automotive display module

DOWSIL™ VE-2003 UV Optical Bonding Material

One-part, transparent, low modulus, low shrinkage, enhanced UV stability, UV curable resins for liquid-based bonding technology product.

June 2019

Radar blowout

DOWSIL™ EC-6601 Electrically Conductive Adhesive

One-part moisture cure electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC).

May 2019

A Thermal Cycler

DOWSIL™ EG-4000 Dielectric Gel

High and low temperature stability gel, suitable for operating temperature ranging from -60°C to + 200°C in continuous mode and > 3,000 hours at 215°C. Soft gel for highly demanding stress-release applications.

March 2019

blowout of white battery

DOWSIL™ EA-4700 CV Adhesive

Through new formulation techniques, this new advanced assembly solution eliminates the need for heat cure ovens whilst exhibiting a fast cure profile with reasonable open times.

March 2019

Thermal gel applied to circuit board

DOWSIL™ TC-3015 Thermal Gel

Dow’s latest patented gel offers thermal management of central processing units in smartphones and other assemblies.

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