Welcome to our electronics product launch page
Here you will find information on our most recently launched innovations for electronics and systems assembly applications.
One-part moisture cure electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC).
High temperature stability gels, suitable for operating temperature ranging from -40C to + 200℃ and > 3,000 hours at 215℃, including increased resistance to delamination under thermal cycling.
Through new formulation techniques, this new advanced assembly solution eliminates the need for heat cure ovens whilst exhibiting a fast cure profile with reasonable open times.