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Latest Product Innovations: Electronics

Welcome to our electronics product launch page

Here you will find information on our most recently launched innovations for electronics and systems assembly applications.

Blowout of automotive display module

DOWSIL™ VE-2003 UV Optical Bonding Material

One-part, transparent, low modulus, low shrinkage, enhanced UV stability, UV curable resins for liquid-based bonding technology product.

June 2019

Radar blowout

DOWSIL™ EC-6601 Electrically Conductive Adhesive

One-part moisture cure electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC).

May 2019

A Thermal Cycler

DOWSIL™ EG-4XXX Dielectric Gels

High temperature stability gels, suitable for operating temperature ranging from -40C to + 200℃ and > 3,000 hours at 215℃, including increased resistance to delamination under thermal cycling.

March 2019

blowout of white battery

DOWSIL™ EA-4700 CV Adhesive

Through new formulation techniques, this new advanced assembly solution eliminates the need for heat cure ovens whilst exhibiting a fast cure profile with reasonable open times.

March 2019

Thermal gel applied to circuit board

DOWSIL™ TC-3015 Thermal Gel

Dow’s latest patented gel offers thermal management of central processing units in smartphones and other assemblies.

Flexible screen consumer device display

DOWSIL™ SE-9100 Adhesive

Learn more about our new, room temperature cure adhesive for enhanced reliability, service life and cost-effective processing.

August 2018

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