Welcome to our Electronics product launch page
Here you will find information on our most recently launched innovations for electronics and systems assembly applications.

DOWSIL™ VE-8001 Flexible Silicone Adhesive
DOWSIL™ VE-8001 Flexible Silicone Adhesive
Two-part elastic hinge adhesive solution for flexible OLED display applications in foldable and rollable consumer devices.
July 2020

DOWSIL™ TC-3065 Thermal Gel
DOWSIL™ TC-3065 Thermal Gel
A one-part, heat cure silicone based thermally conductive gel with good re-workability and low volatile content that helps enable 5G technology to function and contributes to sustainability.
July 2020

DOWSIL™ CC-8030 UV and Dual Moisture Cure Conformal Coating
DOWSIL™ CC-8030 UV and Dual Moisture Cure Conformal Coating
One-part, translucent, medium viscosity, UV and moisture dual curable coating
February 2020

DOWSIL™ VE-6001 UV-T Optical Bonding
DOWSIL™ VE-6001 UV-T Optical Bonding
One-part bonding material for automotive displays requiring high-reliability in harsh environments
June 2019

DOWSIL™ EC-6601 Electrically Conductive Adhesive
DOWSIL™ EC-6601 Electrically Conductive Adhesive
One-part moisture cure electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC).
May 2019

DOWSIL™ EG-4000 Dielectric Gel
DOWSIL™ EG-4000 Dielectric Gel
High and low temperature stability gel, suitable for operating temperature ranging from -60°C to + 200°C in continuous mode and > 3,000 hours at 215°C. Soft gel for highly demanding stress-release applications.
March 2019

DOWSIL™ EA-4700 CV Adhesive
DOWSIL™ EA-4700 CV Adhesive
Through new formulation techniques, this new advanced assembly solution eliminates the need for heat cure ovens whilst exhibiting a fast cure profile with reasonable open times.
March 2019

DOWSIL™ TC-3015 Thermal Gel
DOWSIL™ TC-3015 Thermal Gel
Dow’s latest patented gel offers thermal management of central processing units in smartphones and other assemblies.
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