One-part, transparent, low modulus, low shrinkage, enhanced UV stability, UV curable resins for liquid-based bonding technology product.

One-part moisture cure electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC).

High temperature stability gels, suitable for operating temperature ranging from -40C to + 200℃ and > 3,000 hours at 215℃, including increased resistance to delamination under thermal cycling.

Through new formulation techniques, this new advanced assembly solution eliminates the need for heat cure ovens whilst exhibiting a fast cure profile with reasonable open times.

Dow’s latest patented gel offers thermal management of central processing units in smartphones and other assemblies.

Learn more about our new, room temperature cure adhesive for enhanced reliability, service life and cost-effective processing.