Welcome to our Electronics product launch page
Here you will find information on our most recently launched innovations for electronics and systems assembly applications.
A one-part, heat cure silicone based thermally conductive gel with good re-workability and low volatile content that helps enable 5G technology to function and contributes to sustainability.
One-part moisture cure electrically conductive adhesive with high elongation and stable conductivity designed for electromagnetic compatibility (EMC).
High and low temperature stability gel, suitable for operating temperature ranging from -60°C to + 200°C in continuous mode and > 3,000 hours at 215°C. Soft gel for highly demanding stress-release applications.
Through new formulation techniques, this new advanced assembly solution eliminates the need for heat cure ovens whilst exhibiting a fast cure profile with reasonable open times.