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Thermally conductive adhesive solutions

Strong bonds that cool components

The heat is on as the number density and operating frequencies of components in electronics and systems assemblies increase. As temperatures challenge conventional adhesive materials, let’s work together to identify the silicone solutions that can expand your options for integration, while also optimizing your processing and system costs.

Our thermal adhesives range from low-viscosity liquids to non-slump formulations, and are available in two cure chemistries to meet your exact specification needs:

  1. One-part moisture-cure grades offer simple room-temperature processing to minimize equipment needs
  2. One- or two-part heat-cure solutions help accelerate processing and throughput

Our heat-cure, thermally conductive silicones develop no significant by-products during processing, making them ideal for confined applications, and they do not need mechanical fasteners or clamps. After cure, they convert into strong yet flexible elastomers, and deliver good unprimed adhesion to a variety of common substrates including metals, ceramics and filled plastics.

Additionally, all of our thermally conductive silicones can help enhance the design of your components and offer greater manufacturing flexibility by filling oddly-shaped gaps, reducing interfacial resistance and achieving extremely uniform bond lines, while compensating for board deviation and minor warping.

Quick Links

WEBINAR: Opportunities for Process Optimization with New Silicone Adhesives

A One-Part Thermally Conductive Heat Cure Adhesive
DOWSIL™ TC-2022 Thermally Conductive Adhesive