A one-part thermally conductive heat cure adhesive whose heat cure rate is rapidly accelerated with heat

There is no pre-treatment of surfaces required for this material, and in addition to the thermally conductive benefit, you also get the strong adhesion properties across a wide range of substrates, including:

• AlClad
• FR4
• PBT

Features and benefits

• Primerless adhesion to a variety of substrates
• Heat curable at moderate temperatures (100°C)
• Good thermal conductivity values (1.7W/mK)
• No added solvents
• No mixing of separate components required
• Improved cost effectiveness with rapid/low temperature cure
• Heat flow away from electronic components can increase reliability

Applications suitable for:

• Bonding integrated circuit substrates
• Heat sink attach, automated or manual dispensing
• Engine, power and transmission control units
• Sensors