Enabling efficiency and sustainability in data centers
As the future of communications depends on reliable cloud and data centers, there are growing challenges in efficiency and sustainability. At Dow, we provide a wide range of heat transfer fluids and cooling solutions to help data centers save energy, reduce costs and improve performance.
Direct-to-Chip Liquid Cooling enabled by Dow Solutions
The continual advancement of micro-processor technology to support Artificial Intelligence, the Internet-of-Things, and the overall acceleration of digital platforms has led to increasingly higher heat loads incurred by Datacom Equipment Cooling Systems.
DOWFROST™ LC Heat Transfer Fluid is a propylene glycol-based fluid specifically formulated for liquid cooled, direct-to-chip applications and provides data center systems with exceptional corrosion protection, even in high surface area copper components. DOWFROST™ LC Heat Transfer Fluid is used in these systems to provide freeze protection and limit corrosion to ensure long life of the system. To learn more, please visit the DOWFROST™ LC technical page.
Revolutionary new cooling method with silicone technologies
DOWSIL™ Immersion Cooling Technology is a gamechanger for cooling cloud and data centers. This innovation immerses servers into non-conductive liquid. The thermal energy generated from the hardware transfers into the DOWSIL™ fluid in a single-phase process – electronics are cooled, space is saved and energy costs are reduced. DOWSIL™ Immersion Cooling Technology delivers optimal cooling and thermal conductivity that is heat-resistant, non-flammable liquid and sustainable. To learn more, visit our Immersion Cooling page or watch the short, 2-minute video below.
See how Dow is immersing the cloud in sustainability.