Data Center Cooling
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Cooling Solutions for Data Center & Cloud Performance
Data Center Cooling Solutions
As AI and high-performance computing drive exponential growth in data workloads, the need to manage heat, maintain uptime, and scale efficiently has never been greater. At a global scale, thermal management plays a pivotal role—and Dow delivers. Our cooling solutions combine extensive technical capabilities, global scale, and innovation to enable reliable, efficient, sustainably designed, and future-ready data infrastructure that meets the demands of next-generation computing.
Greater efficiency in direct-to-chip liquid cooling with DOWFROST™ LC
Unlock next-level performance and energy efficiency with Dow’s direct-to-chip (D2C) liquid cooling fluids. Designed to address the growing demands of modern data centers and high-performance computing, Dow’s advanced thermal management solutions dramatically improve heat dissipation where it matters most.
These liquid cooling fluids offer a comprehensive suite of benefits: corrosion protection, efficient heat removal, leak detection (dyed yellow), freeze protection, high purity and low toxicity.
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DOWFROST™ LC 25 Heat Transfer Fluid
Award winning, DOWFROST™ LC 25 offers efficient heat removal and corrosion protection for liquid-cooled DECS with high surface area copper components.
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The Dow Coolant Care Network
Learn more about our Dow backed, end to end approach designed to help data center operators protect uptime, reduce risk, and confidently manage DOWFROST™ LC and DOWFROST™ HD Heat Transfer Fluids across increasingly complex systems.
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Increase your uptime with DOWFROST™ LC 25 Heat Transfer Fluid.
DOWFROST™ LC Heat Transfer Fluid Storage Guide.
Compatibility and Risks of Mixing DOWFROST™ LC 25 with Other PG25 Coolants.
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How to keep a data center operating efficiently
Our heat transfer fluids are helping datacom companies around the globe achieve power usage effectiveness targets while taking on increasing heat loads.
The continuous advancement of micro-processor technology to support Artificial Intelligence, Internet-of-Things, and the overall acceleration of digital platforms has led to increasing heat loads incurred by Datacom Equipment Cooling Systems (DECS). Today, the majority of DECS are using air-cooling techniques, which is resource-intensive and not effective enough to deal with increasing heat loads. Given these trends, and as server rack densities approach and exceed 30 kW, the need for liquid cooled infrastructure is critical.
A hybrid approach to server cooling will be a likely solution inside an individual data center, with air and direct liquid cooling coexisting. “After years of collaboration with industry experts, Dow has launched DOWFROST™ LC Heat Transfer Fluid, specifically formulated for liquid cooled, ‘direct-to-chip’ applications”, said Jordan Rau, Marketing Manager for Heat Transfer Fluids.
DOWFROST™ LC provides the following benefits to customers who are making the switch to liquid cooling:
- Our customers require superior corrosion protection as well as efficient heat removal. These have been key drivers for our R&D teams during the development of these innovations.
- In addition to the heat removal requirements, our liquid cooling products offer freeze protection of temperatures as low as -40°C (-40°F).
- It is important for datacenters to quickly find the source of any leaks they may experience. Our solutions have been dyed fluorescent yellow to enable easy leak detection.
- It is critical for customers to keep their systems running during testing and implementation. Our experts are there to support during the transition.
The migration from air cooling to liquid cooling is still in its infancy as many Data Centers are just now grappling with addressing the ever-increasing data loads on their servers. Additionally, these same companies are also facing societal pressures to reduce energy consumption and water usage. Thus, the need to move to a more efficient means of cooling becomes critical and innovative solutions such as direct-to-chip liquid cooling enabled by DOWFROST™ LC Heat Transfer Fluid can help meet those needs.
Dow has long been an industry leader within thermal management, providing high quality, long-lasting heat transfer fluids for nearly 90 years. We are committed to the continuous advancement of heat transfer-based technologies. Our heat transfer fluids are helping datacom companies around the globe achieve power usage effectiveness targets while taking on increasing heat loads.
Asked Questions about Direct-to-Chip Cooling
DOWFROST™ LC 25 Heat Transfer Fluid is an inhibited propylene glycol-based coolant engineered specifically for liquid-cooled, direct-to-chip (D2C) data center applications. It is designed to efficiently remove heat from high-performance processors while helping protect cooling infrastructure from corrosion, fouling, and fluid-related reliability issues. DOWFROST™ LC 25 Heat Transfer Fluid is commonly used in technical cooling loops serving AI, HPC, hyperscale, and enterprise data centers where thermal management and system reliability are critical. The fluid is supplied pre-diluted at 25% propylene glycol concentration and is ready for immediate use.
DOWFROST™ LC 25 Heat Transfer Fluid has been formulated to support compatibility with many materials commonly used in liquid cooling systems, including copper, copper alloys, brass, stainless steel, as well as many elastomers and plastics. However, material compatibility should always be evaluated based on the specific system design, operating conditions, and original equipment manufacturer (OEM) requirements. Dow recommends consulting the DOWFROST™ LC Engineering Guide and working with equipment suppliers to confirm compatibility for a specific application.
DOWFROST™ LC 25 Heat Transfer Fluid is designed for long-term operation with minimal intervention compared to traditional treated-water cooling systems. Its fully inhibited formulation helps reduce the need for frequent chemical treatment and ongoing maintenance activities. As with any critical cooling infrastructure, Dow recommends periodic fluid monitoring to verify coolant health and system performance throughout the operating life of the data center.
Dow also supports long-term coolant management through the Dow Coolant Care Network, a coordinated network of Dow-approved laboratories, service providers, and technical specialists. It combines fluid testing, data analysis, specialist interpretation, and actionable recommendations to help operators monitor coolant condition, identify emerging issues early, and maintain consistent cooling system performance. This structured approach helps simplify coolant management while supporting reliability, uptime, and operational consistency across data centers.
For application-specific maintenance guidance, coolant health assessments, or recommendations related to your operating conditions, please contact your Dow representative or submit the Contact Us form to connect with a Dow technical specialist.
Coolant selection plays a critical role in managing operational risk and maintaining uptime because fluid performance directly impacts heat transfer efficiency, system cleanliness, material protection, and long-term reliability. Today, the two most common coolant approaches used in direct-to-chip cooling systems are Treated water and inhibited propylene glycol-based fluids (e.g. PG25). While treated water offers excellent thermal properties, it requires strict control of water quality and contamination to maintain performance over time. As a result, many operators and industry groups like Open Compute Project (OCP) recognize PG25 coolants as the standard approach as they offer a better balance between thermal performance, system protection, and operational reliability.
Using a coolant that was not specifically engineered for data center liquid cooling can introduce several risks, including corrosion, scaling, fouling, fluid degradation, biological growth, and compatibility issues with system materials. These issues can reduce heat transfer efficiency, restrict flow through cold plates and heat exchangers, increase maintenance requirements, and ultimately impact cooling performance. In direct-to-chip systems, where precise control of temperature, flow, and pressure is essential, even small changes in fluid quality can increase operational risk and lead to unplanned downtime.
In direct-to-chip (D2C) liquid cooling systems, coolant performance depends on more than just heat transfer. The propylene glycol concentration and corrosion inhibitor package play a critical role in protecting cooling infrastructure, maintaining fluid stability, and supporting long-term data center reliability. DOWFROST™ LC 25 Heat Transfer Fluid is formulated with a carefully engineered balance of both.
The 25% propylene glycol concentration in DOWFROST™ LC 25 Heat Transfer Fluid is designed to offer reliable thermal performance while offering freeze protection down to -10°C (14°F). Because the fluid arrives pre-diluted and ready to use, operators can avoid inconsistencies associated with on-site mixing and achieve consistent fluid properties throughout the cooling loop.
Equally important is the specialized inhibitor package. Direct-to-chip cooling systems commonly contain copper cold plates, brass components, stainless steel, and other metals that can be vulnerable to corrosion if the coolant is not properly protected. DOWFROST™ LC 25 Heat Transfer Fluid contains a robust corrosion inhibitor package, including protection for copper-containing systems, helping reduce the risk of corrosion, fouling, scale formation, and fluid degradation that could impact cooling efficiency and uptime.
The fluid is also manufactured using USP/EP-grade propylene glycol, with a purity of greater than 99.8%, minimizing impurities that can contribute to foaming, odors, deposits, and other maintenance challenges. This helps support long fluid life and lower maintenance requirements.
For AI, HPC, hyperscale, and enterprise data centers, selecting a coolant with the correct glycol concentration and a successful inhibitor package is essential for managing heat while helping protect valuable infrastructure. DOWFROST™ LC 25 Heat Transfer Fluid was specifically engineered for liquid-cooled data center environments to offer efficient heat removal, corrosion protection, fluid stability, and long-term operational confidence.
Recommended sampling frequency should be aligned with the customer’s risk tolerance, operating profile, and desired level of assurance. During commissioning, sampling should be more frequent until the system is fully operational, and fluid chemistry has stabilized. Once the system is fully functional, a typical approach is to continue sampling quarterly to semi-annually during the first two years of operation, then transition to annual testing if results remain stable and no material changes are made to the system or operating conditions.
Expected service life depends on the full system environment, not the fluid alone. In comparable industrial applications using DOWFROST™ Heat Transfer Fluids, they have demonstrated reliable performance for up to 10 years in secondary systems and more than 20 years in facility loops; for a well-managed direct-to-chip system, a practical planning assumption is that a flush-and-fill may be required approximately 5-7 years after installation, subject to actual operating conditions and fluid analysis. Because temperature variation, material aging, oxygen ingress, contamination, and maintenance practices can affect fluid chemistry over time, contractors and owners should ensure proper system cleaning, material compatibility, operation within Dow guidelines (DOWFROST™ LC Engineering Guide), and routine fluid monitoring to manage performance and extend service life.
Dow also supports long-term coolant management through the Dow Coolant Care Network, a coordinated network of Dow-approved laboratories, service providers, and technical specialists. It combines fluid testing, data analysis, expert interpretation, and actionable recommendations to help operators monitor coolant condition, identify emerging issues early, and maintain consistent cooling system performance. This structured approach helps simplify coolant management while supporting reliability, uptime, and operational consistency across data centers.
Thermal interface materials powered by DOWSIL™ silicones
As data centers grow in complexity and density, efficient thermal management is essential to ensure performance, reliability, and energy efficiency. DOWSIL™ thermal interface materials are engineered to meet the demands of high-performance computing environments—delivering long-lasting, reliable cooling across a wide range of applications.
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DOWSIL™ TC-5960
One-part, gray, 6.0 W/mK thermally conductive compound formulated to dissipate heat in bare die electronics applications. DOWSIL™ TC-5960 is non-curing, with low thermal resistance.
DOWSIL™ TC-5026
One-part, gray, 2.9 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, like bare die, insulated-gate bipolar transistors (IGBT) and EVs. DOWSIL™ TC-5026 is non-curing, with low thermal resistance.
DOWSIL™ TC-3080
One-part, 7.0 W/mk thermally conductive ultra soft gel formulated to dissipate heat in electronics applications, like power chips, 5G, autonomous vehicles and telcom. DOWSIL™ TC-3080 is a room temperature cure product with accelerated heat cure and a long working time.
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Broad range of DOWSIL™ materials with varied characteristics to meet diverse thermal management needs—from TIM 1.5 and TIM 2 to complex assemblies.
Proven thermal interface materials designed for durability, low thermal resistance, and consistent performance under demanding conditions.
Worldwide specification and supply capabilities ensure consistent quality and availability, backed by responsive technical support.
Partnering with customers to co-develop next-gen solutions for CPUs, GPUs, telecom systems, optical modules, and server board components.
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Pioneering nanotube thermal management and interfaces
Advancing sustainability in data center cooling with next-gen TIMs—featuring silicone-CNT technology for thinner bondlines, longer life, and reduced material waste.
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Learn how Dow products help to protect today’s complex electronics.
DOWSIL™ Immersion Cooling Technology
Dow’s silicone-based immersion cooling fluids are engineered to meet the thermal management demands of hyperscale data centers, AI servers, and high-performance computing environments. These single-phase fluids offer exceptional thermal stability, low viscosity, and material compatibility, making them ideal for direct-contact cooling of GPUs, CPUs, and other heat-generating components.
By enabling energy-efficient cooling, Dow’s immersion fluids help reduce power consumption, extend equipment lifespan, and support sustainable data center operations. Whether you're designing for cloud infrastructure, edge computing, or AI workloads, our solutions deliver reliable performance at scale.
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For a carbon neutral future, this low-carbon solution features low Global Warming Potential (GWP) and zero Ozone Depletion Potential (ODP) to reduce environmental impact.
For an accelerated outlook of data centers, DOWSIL™ Immersion Cooling is built on stable chemical properties, high material compatibility, and low water absorption.
A safe, high-temperature resistant, and nonflammable liquid without bacteria and mold growing concerns as natural organic fluids.
Delivers optimal cooling and thermal conductivity with low dielectric constant (ranging from 2.1 to 2.2), and low viscosity (10-30 cSt at 40C) with multiple selections.
Reduces noise, costs, and leakage risks, as well as easy to maintain in a convenient location that saves space.
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Facility Water Loop for Data Centers
Facility Water Loop systems are critical to data center operations, ensuring stable thermal management and reliable performance of chilled-water infrastructure as demand for compute and AI continues to grow.
DOWFROST™ HD Heat Transfer Fluid delivers reliable system performance in closed-loop HVAC systems, providing stable heat transfer, robust corrosion protection, effective freeze protection at low temperature, and scalable supply reliability to support uptime and efficient cooling across data center infrastructure.
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DOWFROST™ HD Heat Transfer Fluid, Dyed
DOWFROST™ HD for HVAC is a 94% propylene glycol fluid with corrosion inhibitors, dyed yellow-green for leak detection, offering low-toxicity, long-life performance in HVAC and industrial systems.
DOWCAL™ Heat Transfer Fluids
Meet growing data center cooling demands with heat transfer fluids that deliver efficient heat transfer, reliable system protection, and consistent thermal performance.
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Delivers stable, predictable operation in closed-loop HVAC systems, supporting consistent cooling performance in mission-critical environments.
Ensures effective freeze protection and reliable performance across a wide operating temperature range, even in demanding conditions.
Provides robust, long-term corrosion and microbial protection to reduce the risk of fouling, blockage, and system damage.
Backed by Dow’s global manufacturing footprint and integrated supply chain to support consistent product availability and scalable deployments
Reduces maintenance requirements with simplified fluid management compared to treated-water systems, helping minimize operational complexity.
Frequently Asked Questions about Facility Water Loop
DOWFROST™ HD Heat Transfer Fluid is an inhibited propylene glycol-based fluid used in facility and primary HVAC cooling loops that support data center operations. It helps transfer heat efficiently throughout the cooling infrastructure while offering freeze protection, corrosion protection, and long-term fluid stability. DOWFROST™ HD Heat Transfer Fluid is commonly used in chilled water systems, facility water loops, and other closed-loop HVAC systems serving hyperscale, colocation, and enterprise data centers.
Reliable cooling is essential for continuous data center operation. DOWFROST™ HD Heat Transfer Fluid helps support consistent HVAC performance through stable fluid chemistry, long-term corrosion protection, and reduced risk of fouling or blockage. It also provides freeze protection, helping maintain reliable operation in environments exposed to low temperatures or seasonal weather variations. Together, these benefits support cooling system reliability and help maximize uptime in mission-critical data center facilities.
Yes. DOWFROST™ HD Heat Transfer Fluid is backed by Dow's global manufacturing footprint and integrated supply chain, helping support the needs of hyperscale, colocation, and enterprise data center projects worldwide. With multiple concentration options and decades of thermal-fluid experience, DOWFROST™ HD Heat Transfer Fluid is designed to support reliable cooling performance at scale.
For commercial information, product availability, or project-specific requirements, please contact your Dow representative or submit the Contact Us form.
As data center cooling systems evolve to support AI, high-density computing, and year-round operation, glycol-based fluids have become a preferred choice for facility loops due to their ability to offer both thermal performance and infrastructure protection. Unlike treated water, glycol-based coolants deliver freeze protection for outdoor piping, cooling towers, dry coolers, and other exposed equipment, helping ensure reliable operation across a wide range of climates and operating conditions.
DOWFROST™ HD Heat Transfer Fluid is formulated with high-purity propylene glycol and a specially designed corrosion inhibitor package that helps protect critical cooling infrastructure, including heat exchangers, piping, pumps, and valves. In addition to protecting against corrosion, DOWFROST™ HD Heat Transfer Fluid helps reduce the risk of scaling, fouling, and system degradation that can negatively impact heat transfer efficiency and increase maintenance costs. Its low-toxicity formulation, long fluid life, and fluorescent dye for leak detection further support safe, reliable, and cost-effective operation. By combining freeze protection, corrosion control, and long-term fluid stability, DOWFROST™ HD Heat Transfer Fluid helps data center operators improve system reliability, protect capital assets, and maintain consistent cooling performance over the life of the facility.
Glycol concentration is one of the most important variables in facility loop design because it directly influences system protection, thermal performance, and operating efficiency. Increasing glycol concentration improves freeze protection, making it essential for systems exposed to low ambient temperatures or outdoor conditions. However, as glycol concentration increases, fluid viscosity also increases, which can require more pumping energy to maintain target flow rates.
For this reason, selecting the proper glycol concentration requires balancing environmental protection with cooling system performance. The optimal concentration depends on factors such as climate conditions, system design, operating temperatures, and reliability requirements.
DOWFROST™ HD Heat Transfer Fluid is available across a range of concentrations and is supported by decades of Dow experience in heat transfer fluids, helping operators identify the appropriate balance between freeze protection, thermal efficiency, and hydraulic performance. By properly specifying glycol concentration and maintaining fluid quality over time, operators can achieve reliable year-round operation while minimizing energy consumption and protecting critical cooling infrastructure.
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