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Data Center Cooling
Let's power the future of data centers together
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Data Center Cooling
Data Center Cooling Solutions
As AI and high-performance computing drive exponential growth in data workloads, the need to manage heat, maintain uptime, and scale efficiently has never been greater. At a global scale, thermal management plays a pivotal role—and Dow delivers. Our cooling solutions combine extensive technical capabilities, global scale, and innovation to enable reliable, efficient, sustainably designed, and future-ready data infrastructure that meets the demands of next-generation computing.
Greater efficiency in direct-to-chip liquid cooling with DOWFROST™ LC
Unlock next-level performance and energy efficiency with Dow’s direct-to-chip (D2C) liquid cooling fluids. Designed to address the growing demands of modern data centers and high-performance computing, Dow’s advanced thermal management solutions dramatically improve heat dissipation where it matters most.
These liquid cooling fluids offer a comprehensive suite of benefits: corrosion protection, efficient heat removal, leak detection (dyed yellow), freeze protection, high purity and low toxicity.
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DOWFROST™ LC 25 Heat Transfer Fluid
Award winning, DOWFROST™ LC 25 offers efficient heat removal and corrosion protection for liquid-cooled DECS with high surface area copper components.
DOWFROST™ HD Heat Transfer Fluid, Dyed
DOWFROST™ HD for HVAC is a 94% propylene glycol fluid with corrosion inhibitors, dyed yellow-green for leak detection, offering low-toxicity, long-life performance in HVAC and industrial systems.
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How to keep a data center operating efficiently
Our heat transfer fluids are helping datacom companies around the globe achieve power usage effectiveness targets while taking on increasing heat loads.
The continuous advancement of micro-processor technology to support Artificial Intelligence, Internet-of-Things, and the overall acceleration of digital platforms has led to increasing heat loads incurred by Datacom Equipment Cooling Systems (DECS). Today, the majority of DECS are using air-cooling techniques, which is resource-intensive and not effective enough to deal with increasing heat loads. Given these trends, and as server rack densities approach and exceed 30 kW, the need for liquid cooled infrastructure is critical.
A hybrid approach to server cooling will be a likely solution inside an individual data center, with air and direct liquid cooling coexisting. “After years of collaboration with industry experts, Dow has launched DOWFROST™ LC Heat Transfer Fluid, specifically formulated for liquid cooled, ‘direct-to-chip’ applications”, said Jordan Rau, Marketing Manager for Heat Transfer Fluids.
DOWFROST™ LC provides the following benefits to customers who are making the switch to liquid cooling:
- Our customers require superior corrosion protection as well as efficient heat removal. These have been key drivers for our R&D teams during the development of these innovations.
- In addition to the heat removal requirements, our liquid cooling products offer freeze protection of temperatures as low as -40°C (-40°F).
- It is important for datacenters to quickly find the source of any leaks they may experience. Our solutions have been dyed fluorescent yellow to enable easy leak detection.
- It is critical for customers to keep their systems running during testing and implementation. Our experts are there to support during the transition.
The migration from air cooling to liquid cooling is still in its infancy as many Data Centers are just now grappling with addressing the ever-increasing data loads on their servers. Additionally, these same companies are also facing societal pressures to reduce energy consumption and water usage. Thus, the need to move to a more efficient means of cooling becomes critical and innovative solutions such as direct-to-chip liquid cooling enabled by DOWFROST™ LC Heat Transfer Fluid can help meet those needs.
Dow has long been an industry leader within thermal management, providing high quality, long-lasting heat transfer fluids for nearly 90 years. We are committed to the continuous advancement of heat transfer-based technologies. Our heat transfer fluids are helping datacom companies around the globe achieve power usage effectiveness targets while taking on increasing heat loads.
FAQs: Direct-to-chip liquid cooling
Yes. For systems greater than 500 gallons, we offer complimentary annual analysis for Dow fluids. For systems that do not qualify or if more frequent analysis is required by the end user, we will direct you to a Dow-qualified 3rd party lab to handle the analysis for a fee. In both cases, Dow will be involved in issuing reports, reviewing data, and providing recommendations.
DOWFROST™ LC 25 Heat Transfer Fluid is designed toprevent biogrowth , ensuring system efficiency and longevity in liquid cooling applications. Tested to industry standards (ASTM E2315), DOWFROST™ LC 25 showcases significant biostatic properties , effectively preventing the growth of a variety of bacteria, yeast, and fungi.
Fluid analysis is recommended on an annual basis as fluid conditions are not expected to change significantly over the course of a year. If more frequent analysis is needed, we can direct you to a Dow-approved 3rd party lab.
For out of spec systems, Dow will provide a recommendation for remediation. In most cases, boosters are available to adjust fluid concentration, pH, and inhibitor levels as needed.
Thermal interface materials powered by DOWSIL™ silicones
As data centers grow in complexity and density, efficient thermal management is essential to ensure performance, reliability, and energy efficiency. DOWSIL™ thermal interface materials are engineered to meet the demands of high-performance computing environments—delivering long-lasting, reliable cooling across a wide range of applications.
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DOWSIL™ TC-5960
One-part, gray, 6.0 W/mK thermally conductive compound formulated to dissipate heat in bare die electronics applications. DOWSIL™ TC-5960 is non-curing, with low thermal resistance.
DOWSIL™ TC-5026
One-part, gray, 2.9 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, like bare die, insulated-gate bipolar transistors (IGBT) and EVs. DOWSIL™ TC-5026 is non-curing, with low thermal resistance.
DOWSIL™ TC-3080
One-part, 7.0 W/mk thermally conductive ultra soft gel formulated to dissipate heat in electronics applications, like power chips, 5G, autonomous vehicles and telcom. DOWSIL™ TC-3080 is a room temperature cure product with accelerated heat cure and a long working time.
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Broad range of DOWSIL™ materials with varied characteristics to meet diverse thermal management needs—from TIM 1.5 and TIM 2 to complex assemblies.
Proven thermal interface materials designed for durability, low thermal resistance, and consistent performance under demanding conditions.
Worldwide specification and supply capabilities ensure consistent quality and availability, backed by responsive technical support.
Partnering with customers to co-develop next-gen solutions for CPUs, GPUs, telecom systems, optical modules, and server board components.
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Pioneering nanotube thermal management and interfaces
Advancing sustainability in data center cooling with next-gen TIMs—featuring silicone-CNT technology for thinner bondlines, longer life, and reduced material waste.
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Learn how Dow products help to protect today’s complex electronics.
DOWSIL™ Immersion Cooling Technology
Dow’s silicone-based immersion cooling fluids are engineered to meet the thermal management demands of hyperscale data centers, AI servers, and high-performance computing environments. These single-phase fluids offer exceptional thermal stability, low viscosity, and material compatibility, making them ideal for direct-contact cooling of GPUs, CPUs, and other heat-generating components.
By enabling energy-efficient cooling, Dow’s immersion fluids help reduce power consumption, extend equipment lifespan, and support sustainable data center operations. Whether you're designing for cloud infrastructure, edge computing, or AI workloads, our solutions deliver reliable performance at scale.
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For a carbon neutral future, this low-carbon solution features low Global Warming Potential (GWP) and zero Ozone Depletion Potential (ODP) to reduce environmental impact.
For an accelerated outlook of data centers, DOWSIL™ Immersion Cooling is built on stable chemical properties, high material compatibility, and low water absorption.
A safe, high-temperature resistant, and nonflammable liquid without bacteria and mold growing concerns as natural organic fluids.
Delivers optimal cooling and thermal conductivity with low dielectric constant (ranging from 2.1 to 2.2), and low viscosity (10-30 cSt at 40C) with multiple selections.
Reduces noise, costs, and leakage risks, as well as easy to maintain in a convenient location that saves space.
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