Next-generation silicones for next-level computing systems
In today’s fast paced world, no one has the time to deal with slow, unreliable computers and processing systems – and no one should have to.
Our broad portfolio of thermal materials can help you design more reliable computing systems with a lower total cost of ownership. With Dow Consumer Solutions by your side, you have the advanced materials and proven expertise needed to protect your valuable processors from rising operating temperatures and complete meltdowns.
Silicone thermal materials, by nature, are stable under a wide range of operating temperatures and offer a broad choice of thermal conductivity.
DOWSIL™ TC-5888 Thermally Conductive Compound is a one-part material that combines excellent thermal management for improved reliability, with a flow profile that enhances both productivity and precision.