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DOWSIL™ TC-5888 Thermally Conductive Compound

Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.

Benefits:

  • One-Part Material: No cure is required when applying the material.
  • Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
  • Thermal Stability: Delivers consistent performance and reliability under high temperatures.
  • Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.

Drawing out heat and delivering maximum performance and reliability in computing hardware

For years, electronic manufacturers have explored ways to design slimmer, smaller devices that deliver higher performance and functionality. But as the design becomes more compact, the amount of heat generated within the device increases. To facilitate cooler devices, which in turn allows for more efficient operation and better reliability over its life, Dow has released a new thermally conductive compound solution for electronic modules, including computer MPUs, server applications, and power modules.

DOWSIL™ TC-5888 Thermally Conductive Compound is the latest from Dows' innovative and industry leading portfolio of thermally conductive silicones. It combines excellent thermal management for improved reliability, with a flow profile that enhances both productivity and precision.

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DOWSIL™ TC-5888 Thermally Conductive Compound
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DOWSIL™ TC-5888 Thermally Conductive Compound
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