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DOWSIL™ TC-5888 Thermally Conductive Compound

Gray, thixotropic, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.


  • One-Part Material: No cure is required when applying the material.
  • Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.
  • Thermal Stability: Delivers consistent performance and reliability under high temperatures.
  • Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.

Drawing out heat and delivering maximum performance and reliability in computing hardware

For years, electronic manufacturers have explored ways to design slimmer, smaller devices that deliver higher performance and functionality. But as the design becomes more compact, the amount of heat generated within the device increases. To facilitate cooler devices, which in turn allows for more efficient operation and better reliability over its life, Dow has released a new thermally conductive compound solution for electronic modules, including computer MPUs, server applications, and power modules.

DOWSIL™ TC-5888 Thermally Conductive Compound is the latest from Dows' innovative and industry leading portfolio of thermally conductive silicones. It combines excellent thermal management for improved reliability, with a flow profile that enhances both productivity and precision.

  • DOWSIL™ 7091 Adhesive Sealant
    High performance, neutral cure silicone adhesive/sealant.

  • DOWSIL™ TC-5026 Thermally Conductive Compound
    Designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles.

  • DOWSIL™ TC-5622 Thermally Conductive Compound

    These are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability.

  • DOWSIL™ 3-4207 Dielectric Tough Gel Kit
    Two-part, translucent green, fast RT or heat cure, tough, primerless chemical adhesion, UV indicator, and UL 94 V-1 flammability classification.

  • DOWSIL™ TC-2035 Adhesive A/B Kit
    Two-part heat cure silicone highly thermally conductive adhesive with low bond line thickness.

  • DOWSIL™ SE 4485 Thermally Conductive Adhesive
    Designed to provide efficient thermal transfer for the cooling of electronics modules, including lamp, telecom, and power supply devices. It is a one-part, white, moisture cure, thermal conductivity silicone adhesive.

  • DOWSIL™ TC-5351
    Suitable for use as a thermally conductive material in power electronics. It is a one-part grey, and non-curing thermally conductive compound.

  • SYLGARD™ 170 Silicone Elastomer Kit
    Two-part, black, 1:1, RT or heat cure, low viscosity, general purpose, UL and Mil Spec.

  • DOWSIL™ 2634 Coating

    New alkoxysilane functional perfluoropolyether (PFPE) hybrid polymers that exhibit the synergistic effects of the oleophobicity and low coefficient of friction of fluoro-polymers and the hydrophobicity and durability of silicone. Improved abrasion and UV durability over current chemical treatments are obtained with the use of a mono-functional terminal alkoxy silane to the PFPE polymer. The alkoxy silane reactive end will covalently bond to the surface via hydrolysis and con-densation reactions, resulting in a structurally ordered chemical modi-fication of the surface. This covalent bond gives the needed durability in applications such as touch-screen displays.

  • DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
    A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.

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DOWSIL™ TC-5888 Thermally Conductive Compound
No Technical Data Sheets are available online for this material.
Please Contact Dow for additional information.


DOWSIL™ TC-5888 Thermally Conductive Compound

No Regulatory Data Sheets are available online for this product.

DOWSIL™ TC-5888 Thermally Conductive Compound
Please Contact Dow for distribution options available for this product.