Additives for Thermosetting Resins

Thermoset materials such as epoxy molding compounds (EMCs), phenolics and urethanes are well suited for applications that require excellent mechanical strength and physical properties. Meeting more-stringent requirements – driven by technological trends such as electronics miniaturization and higher usage temperatures – thermosets need higher performance capabilities. This is where Dow’s silicone-based additives come in as they significantly upgrade thermoset materials in multiple ways.  

EMCs are widely used for encapsulating semiconductor chips. Dow’s thermoset additives for EMCs improve the durability of electronic components at high temperatures and humidity and prevent bleed-out from composites. They provide stress relief during heat cycling to minimize cracking, distortion and warpage. These versatile additives can also provide better flame retardancy and are made of non-halogenated polymers. In processing, they reduce the viscosity of EMCs so they can penetrate and fill small gaps and make better anti-moisture composites. Compared to other options, such as PTFE and acrylic and urethane powders, our additives offer wider compatibility with different types of thermoset materials and deliver longer-lasting performance.