Properties
typical.properties.Title |
|
---|---|
Thermal Conductivity | 5 W/m・K |
Deliver To:
Introducing new DOWSIL™ TC-5550 Thermally Conductive Compound - created for the high-performance materials challenges in next-generation electronics technology. This innovative silicone grease can be used in place of a PCM or thermal pad, and was designed for bare die and lidless CPUs, providing high pump-out resistance and high-throughput.
typical.properties.Title |
|
---|---|
Thermal Conductivity | 5 W/m・K |