Properties
Typical Properties |
|
|---|---|
| Color | Gray |
| Cure Type | No cure |
| Material Type | Compounds and Greases, Gap Filler |
| Number of Parts | 1 part |
| Specific Gravity | 3.1 |
| Thermal Conductivity | 3.3 W/m・K |
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DOWSIL™ TC-5351 Thermally Conductive Compound
Overview
Properties
Technical Content
Sample Options
What is DOWSIL™ TC-5351 Thermally Conductive Compound?
One-part, gray, non-curing, 3.3 W/mK thermally conductive gap filler formulated to dissipate heat in electronics applications, such as lighting, automotive, and power. DOWSIL™ TC-5351 is room temperature storable and demonstrates vertical gap-fill capability up to 1.0 mm.
Uses
- Heat dissipation
- Vibration damping
- Stress relief
- Thermal interface material (TIM)
Benefits
- Thermal conductivity: 3.3 W/mK
- Non-curing
- Screen printable
- Good stability on vertical surfaces
- Vertical gap-fill capability up to 1.0 mm
Materials Training
These videos explain the importance of heat protection in electronics, introduce five types of thermally conductive materials, demonstrate handling and dispensing methods, and offer tips for choosing the best Dow silicone solutions for optimal thermal management.
Overview of thermal materials and their roles in electronic heat management.
Overview of dispensing, curing, packaging, and storage of thermal materials.
Overview of common challenges and practical tips when handling thermal materials.
Overview of leading products, selection guides and application examples.
Overview of common application questions and technical review.