DOWSIL™ TC-4551 CV Thermally Conductive Gap Filler
5 W/m・K silicone gap filler, two-part material curing at room temperature.
Benefits:
- Thermal conductivity: 5.2 W/m・K
- Room temperature cure or heat accelerated cure
- Long term performance stability during temperature cycling up to 150°C
- Holds vertical position in the assembly after cured
- Controlled silicone volatility
- UL 94 V-0 (0.15 mm, Thickness & 3.0 mm, Thickness)
- soft and compressible material once cured
- designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink
- provides a reliable cooling solution for electronics modules such as engine or transmission control units
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
No sales specification could be found for this material in selected language
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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