DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
Properties
These values are typical properties and are not intended for use in preparing specifications.
- Color - Part A Yes No White
- Density Yes No 3.1 grams per cc
- Dielectric Constant at 1MHz Yes No 6.5/5E-3
- Mixing Viscosity Yes No 205 Centipoise
- Number of Parts Yes No Two
- Shelf Life Yes No 360 Days
- Thermal Conductivity Yes No 3.5 W/m・K
- Thixotropic Index Yes No 3.6
- Viscosity - Part A Yes No 200 Pa.s
- Viscosity - Part B Yes No 230 Pa.s
- Volume Resistivity Yes No 3E+13 Ω・cm
- Working Time in hrs at 25 Deg C Yes No 60 minutes
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
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All products must have the same delivery date
All products must be in the same product family
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All products must be shipped from the same plant
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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