DOWSIL™ TC-4025 Dispensable Thermal Pad Kit

What is DOWSIL™ TC-4025 Dispensable Thermal Pad Kit?

Two-part, blue, 2.5 W/mK thermally conductive gap filler formulated to dissipate heat in electronics applications, such as electronic control units (ECU), advanced driver assistance systems (ADAS), and power electronics. DOWSIL™ TC-4025 Dispensable Thermal Pad Kit is a rapid dispense product, intended for high throughput applications.

Uses

Heat dissipation
Vibration damping
Stress relief
Thermal interface material (TIM)

Benefits

Thermal conductivity: 2.5 W/mK
Room temperature or heat-accelerated cure
Cure time: 24 hr at 25 °C, 30 min at 125 °C
Hardness: 61 Shore 00
Rapid dispense, self-leveling
Soft, stress relieving
Reworkable

Properties

Product Use and Formulating
Mixing Ratio	1:1 wt%
Room Temperature Cure	24 Hours

Typical Properties
Color	Blue
Cure Type	Heat accelerated cure, Room temperature cure
Durometer - Shore 00	61
Heat Cure	30 min @ 125 °C
Material Type	Gap Filler
Number of Parts	2 part
Specific Gravity	2.8
Thermal Conductivity	2.5 W/m・K

Materials Training

These videos explain the importance of heat protection in electronics, introduce five types of thermally conductive materials, demonstrate handling and dispensing methods, and offer tips for choosing the best Dow silicone solutions for optimal thermal management.