DOWSIL™ TC-3065 Thermal Gel
A one-part, 6.5W/mk thermal conductivity silicone gel. It’s printable or dispensable to cure as a soft thermal gel to replace fabricated thermal pads for thermal transferring, stress relieving and shock damping. Room temperature curing, or accelerated curing at 60°C or higher temperature for shorter curing time.
Uses:
- Telecom devices or equipment, e.g. optical transceivers, ethernet switches, routers, etc.
- Datacom equipment, e.g. high speed solid-state disks (SSD)
Benefits:
- High thermal conductivity (6.5W/mk)
- Excellent extrusion rate (60 g/min) to support easy auto-dispensing process
- Resists humidity and other harsh environments without cracking and slumping
- Ultra low volatile content
Properties
These values are not intended for use in preparing specifications.
Typical Properties
- Durometer - Shore 00 Yes No 50 Shore 00
- Elongation Yes No 20 %
- Shelf Life Yes No 365 Days
- Specific Gravity Yes No 3.45 g/cm3
- Thermal Conductivity Yes No 6.5 W/m・K
- Volume Resistivity Yes No 7 E+13 Ω・cm
- Working Time Yes No 7200 Minutes
High extrusion rate thermal gel with strong thermal conductivity and low voltile content
How can we meet the demands of both 5G technology and sustainability? 5G designs require greater power densities, which produce greater heat. Technology with such high temperature output requires materials that help dissipate the heat. And those materials must also have low volatile content (VOC) if they are to be eco-friendly. To meet both needs requires materials like DOWSIL™ TC-3065 Thermal Gel.
DOWSIL™ TC-3065 Thermal Gel is a one-part, heat cure silicone based thermally conductive gel with good re-workability. It’s supplied as non-flowable paste and can be pressed lower to 150 um thickness in thermal management applications. It can be cured to an elastic pad, with tensile strength and elongation that enables the material to be peeled off easily and completely without residue in the rework process. This material contains ultra low VOC, and can resist humidity and other harsh environments without oil-bleeding, cracking and slumping. Thus, DOWSIL™ TC-3065 Thermal Gel not only enables your 5G technology to function and contributes to sustainability but optimizes the process by which that technology is assembled.
DOWSIL™ TC-3065 Thermal Gel Video
Learn about a thermally conductive silicone gel that helps enable 5G technology to function and contributes to sustainability.
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
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