One-part, cures to ultra soft thermally conductive gel. It can be used for dispensing and stencil printing process. Ultra soft properties help stress relieving and shock damping and improve devices reliability. Excellent thermal performance and reliability attributes heat dissipation and resists heat/humidity and other harsh environments.
Offers good heat dissipation and stress relief for power devices such as 5G smartphone, communication base stations, etc.
Thermal interface material used in smartphone CPU, memory chips
Dispensed or screen printing to various thickness and shapes for general thermal management of PCBA assemblies
High extrusion rate and long work time
Cured to ultra-soft thermal gel at 80°C for 30 min
Use as printable or dispensable thermal gel
Ultra-soft thermal gel for thermal transferring, stress relieving and shock damping
Resists heat/humidity and other harsh environments
Very long working time at room temperature
Excellent thermal performance and reliability
DOWSIL™ TC-3035 S Soft Thermal Gel and its benefits in 5G electronics
Provides next-level cooling in high-performance electronics while delivering 4W/mK thermal conductivity, decreases chip temperature and improves power chip working efficiency.