DOWSIL™ TC-3015 Re-workable Thermal Gel
A one part, heat cure silicone based thermally conductive gel with good re-workability. It’s supplied as non-flowable paste and can be pressed lower to 100 um thickness in thermal management application. It can be cured to elastic pad with certain tensile strength and elongation which can make sure the material can be peeled off easily and completely without residue in rework process.
These values are typical properties and are not intended for use in preparing specifications.
- Color Yes No Light Pink
- Dielectric Strength Yes No 14.7 kV/mm volts per mil v/mil
- Durometer - Shore 00 Yes No 72 Shore 00
- Elongation Yes No 72% %
- Number of Parts Yes No One
- Shelf Life Yes No -20C storage Days
- Specific Gravity Yes No 2.6
- Tensile Strength Yes No 0.3 MPa psi
- Thermal Conductivity Yes No 2.0 W/mK Watts per meter K
- Viscosity Yes No 220000 mPa.s
- Volume Resistivity Yes No 5.9 E+14 ohm*cm ohm-centimeters
DOWSIL™ TC-3015 Thermal Conductive Silicone Gel is a one-part silicone formulation for thermal management of smartphone components.
It is generally cured at room temperature, eliminating the need for a separate curing process. Alternatively, faster curing is possible by exposing the material to temperatures of up to 150°C.
Excellent wettability ensures low contact resistance and even thermal management without hot spots for the integrated circuit (IC) and central processing unit (CPU), the hottest smartphone component.
As a printable or dispensable product, DOWSIL™ TC-3015 Thermal Conductive Silicone Gel can be integrated into automated processes, avoiding the need for time-consuming application of fabricated thermal pads.
Watch the video and see how this innovative material can be automatically dispensed for improved manufacturing efficiency and can be peeled off intact – with no residue – for easy repair.
Frequently Bought Together
- DOWSIL™ Primer-C OS
DOWSIL™ 791 Weatherproofing Sealant
A one-part, medium-modulus, elastomeric sealant designed for general weathersealing. It is a silicone formulation that cures to a flexible and curable silicone rubber building joint seal.
DOWSIL™ 7091 Adhesive Sealant
High performance, neutral cure silicone adhesive/sealant.
DOWSIL™ 756 SMS Building Sealant
A medium-modulus elastomeric sealant designed for weatherproofing sensitive porous stone and metal panel substrates to reduce residue rundown and substrate staining in new and remedial construction.
DOWSIL™ 790 Silicone Building Sealant
A one-part silicone formulation that cures in the presence of atmospheric moisture to produce a durable, fire-resistant, flexible and ultra-low-modulus silicone rubber building joint seal.
DOWSIL™ 995 Silicone Structural Sealant
A one-component, self-priming, shelf-stable, neutral-cure, elastomeric adhesive specifically formulated for silicone structural glazing and exhibits excellent unprimed adhesion to most building substrates. This product has superior unprimed adhesion for structural glazing applications for hurricane or impact rated windows and doors. It has a movement capability of +/- 50%.
DOWSIL™ 1200 OS Primer
An air drying primer supplied as a dilute solution of moisture reactive materials in volatile siloxane and is used to improve both the quality and speed of adhesion development to room temperature vulcanizing silicone sealants to a variety of common non-porous substrates.
DOWSIL™ 556 Cosmetic Grade Fluid
A polyphenylmethylsiloxane for use in skincare, suncare, color cosmetic, hair care, and antiperspirant / deodorant applications. INCI Name: Phenyl Trimethicone
DOWSIL™ 983 Structural Glazing Sealant Base and Curing Agent
Designed for specialized use where dual structural and weatherseal applications are desired for factory glazing and curtainwall production. Once cured, this structural sealant forms a durable, flexible, watertight bond that can be warranted for 20 years and used in ±25% movement weatherseal applications. It has excellent unprimed adhesion to glass, alodine, and anodized aluminum1, although DOWSIL™ Primer-C OS is recommended for fast and consistent adhesion, especially to high-performance substrates approved for architectural structural glazing applications.
DOWSIL™ Q1-9226 Thermally Conductive Adhesive
Typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications. It is a two-part, gray, 1:1 mix ratio, heat cure, moderate flow, self-priming, thermally conductive adhesive.
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.