DOWSIL™ TC-3015 Re-workable Thermal Gel
A one part, heat cure silicone based thermally conductive gel with good re-workability. It’s supplied as non-flowable paste and can be pressed lower to 100 um thickness in thermal management application. It can be cured to elastic pad with certain tensile strength and elongation which can make sure the material can be peeled off easily and completely without residue in rework process.
DOWSIL™ TC-3015 Thermal Conductive Silicone Gel is a one-part silicone formulation for thermal management of smartphone components.
It is generally cured at room temperature, eliminating the need for a separate curing process. Alternatively, faster curing is possible by exposing the material to temperatures of up to 150°C.
Excellent wettability ensures low contact resistance and even thermal management without hot spots for the integrated circuit (IC) and central processing unit (CPU), the hottest smartphone component.
As a printable or dispensable product, DOWSIL™ TC-3015 Thermal Conductive Silicone Gel can be integrated into automated processes, avoiding the need for time-consuming application of fabricated thermal pads.
Learn More
Watch the video and see how this innovative material can be automatically dispensed for improved manufacturing efficiency and can be peeled off intact – with no residue – for easy repair.
Properties
These values are typical properties and are not intended for use in preparing specifications.
- Color Light Pink
- Dielectric Strength 14.7 kV/mm volts per mil v/mil
- Durometer - Shore 00 72 Shore 00
- Elongation 72% %
- Number of Parts One
- Shelf Life -20C storage Days
- Specific Gravity 2.6
- Tensile Strength 0.3 MPa psi
- Thermal Conductivity 2.0 W/mK Watts per meter K
- Viscosity 220000 mPa.s
- Volume Resistivity 5.9 E+14 ohm*cm ohm-centimeters
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
