DOWSIL™ SE 4486 Thermally Conductive Adhesive
Designed to provide efficient thermal transfer for the cooling of electronic modules, including home appliance devices. It is a one-part, white, moisture cure RTV, highly flowable, fast tack-free, high thermally conductive adhesive with controlled volatility.
Properties
These values are not intended for use in preparing specifications.
Typical Properties
- Dielectric Constant at 1MHz Yes No 4.8
- Dielectric Strength Yes No 500 volts per mil v/mil
- Durometer - Shore A Yes No 81
- Dynamic Viscosity Yes No 19600 Centipoise
- Elongation Yes No 43 %
- Room Temperature Cure Yes No 168 Hours
- Shear Yes No 240 psi psi
- Specific Gravity @ 25°C Yes No 2.6
- Tensile Strength Yes No 570 psi
- Thermal Conductivity Yes No 1.6 W/m・K
- Volume Resistivity Yes No 2e+014 Ω・cm
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
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The following Rules apply:
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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