DOWSIL™ SE 4450 Thermally Conductive Adhesive

What is DOWSIL™ SE 4450 Thermally Conductive Adhesive?

One-part, gray, 1.9 W/mK thermally conductive adhesive formulated for sealing and bonding components in electronics applications, such as electronic modules, chip packaging, and printed circuit board assembly (PCB). DOWSIL™ SE 4450 Thermally Conductive Adhesive is a heat cure product with self-leveling characteristics and high tensile strength.

Uses

Heat dissipation
Sealing
Bonding
Thermal interface material (TIM)

Benefits

Thermal conductivity: 1.9 W/mK
Heat cure: 30 min at 125 °C, 15 min at 150 °C
Adhesion: 3.5 MPa aluminum lap shear joint
High tensile strength: 6.7 MPa
Elongation at break: > 45%

Properties

Typical Properties
Color	Gray
Cure Type	Heat accelerated cure
Durometer - Shore A	95
Elongation	46 %
Heat Cure	30 min @ 150 °C
Material Type	Adhesive
Number of Parts	1 part
Specific Gravity	2.7
Tensile Strength in MPa	6.7 MPa
Thermal Conductivity	1.9 W/m・K
Unprimed Adhesion - Lap Shear	3.45 MPa

Materials Training

These videos explain the importance of heat protection in electronics, introduce five types of thermally conductive materials, demonstrate handling and dispensing methods, and offer tips for choosing the best Dow silicone solutions for optimal thermal management.