DOWSIL™ ME-4139 Encapsulant Dark Grey
One-part, dark grey, heat cure, controlled thixotropy-flowable as dispensed, self-priming adhesion.
Uses:
- Where a semiconductor die has been wire bonded to a flat surface.
- Where there is a need for a flexible coating
- wide extremes of temperature, with the use of a pliable epoxy substrate or where severe thermal shocks are encountered
- Compatible with most semiconductor devices and provides environmental and physical protection of both the chip and interconnecting wires in a single application
Benefits:
- High purity
- Controlled thixotropy and yet flowable as dispensed
- Optimum coating to cover bonding wires
- Flexibility over a wide temperature range
- Excellent dielectric properties
- Excellent adhesion to ceramic, epoxy and polyimide substrates
- Protection from moisture, dirt and other contaminants
- One-part elastomer with fast heat cure
Properties
These values are not intended for use in preparing specifications.
Typical Properties
- Color Yes No Dark Grey
- Durometer - Shore A Yes No 28 Shore A
- Dynamic Viscosity Yes No 45000 Centipoise
- Heat Cure Yes No 60 Minutes @ 150 Deg C
- Number of Parts Yes No One
- Specific Gravity @ 25°C Yes No 1.15
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
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All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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