DOWSIL™ ME-1800 Adhesive
Conductive adhesive with high electrical/thermal conductivity.
Uses:
- Conductive adhesive for grounding
- Suitable for microelectronics thermal interface applications
Benefits:
- High electrical conductivity (Enables electrically conductive performance)
- High thermal conductivity (Increases reliability by removing heat)
- Good adhesion to Ni, Al, laminate, and silicon (Good for die attach, lid seal, or TIM1)
- Low ionic impurities (Microelectronics grade material)
Properties
These values are not intended for use in preparing specifications.
Typical Properties
- Color Yes No Gray
- Cure Characteristics Yes No Heat Cure >100C
- Special Characteristics Yes No One Part
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
No sales specification could be found for this material in selected language
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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