Properties
Typical Properties |
|
|---|---|
| Color | Gray |
| Cure Type | Heat accelerated cure |
| Durometer - Shore A | 91 |
| Heat Cure | 120 min @ 150 °C |
| Material Type | Adhesive |
| Number of Parts | 1 part |
| Specific Gravity | 4.4 |
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DOWSIL™ ME-1800 Adhesive
Overview
Properties
Technical Content
Sample Options
What is DOWSIL™ ME-1800 Adhesive?
One-part, gray, 6.8 W/mK thermally conductive adhesive formulated for sealing and bonding components in electronics applications, such as grounding, die attach, and microelectronics. DOWSIL™ ME-1800 Adhesive is a heat cure product with high thermal and electrical conductivity.
Uses
- Heat dissipation
- Sealing
- Bonding
- Thermal interface material (TIM)
Benefits
- Thermal conductivity: 6.8 W/mK
- Volume resistivity: 1.8*10-4 ohm-cm
- Heat cure: 120 min at 150 °C
- Adhesion: 1.3 MPa aluminum lap shear joint
- Thermal resistance: 0.06 °C-cm2/W - 10 µm BLT
- Good adhesion to Ni, Al, laminate, and silicon
- Microelectronics grade
Materials Training
These videos explain the importance of heat protection in electronics, introduce five types of thermally conductive materials, demonstrate handling and dispensing methods, and offer tips for choosing the best Dow silicone solutions for optimal thermal management.
Overview of thermal materials and their roles in electronic heat management.
Overview of dispensing, curing, packaging, and storage of thermal materials.
Overview of common challenges and practical tips when handling thermal materials.
Overview of leading products, selection guides and application examples.
Overview of common application questions and technical review.