Properties
Application Benefits |
|
|---|---|
| Use | Boards and Assemblies, Components |
Typical Properties |
|
|---|---|
| Linear CTE | 300 um/m/Deg C |
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DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit
Overview
Properties
Technical Content
Sample Options
What is DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit?
Suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step.
Uses
- DOWSIL™ EE-1010 Low Viscosity Encapsulant is suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step
- Material can be dispensed manually or through meter mixing
Benefits
- Long working time
- Room temperature cure or accelerated heat cure
- High hardness/durometer compared to other PCB system assemblies encapsulants
- Moderate thermal conductivity
- Different colors for Part A and Part B for easy identification of mixing
- In complex geometries, low viscosity enhances flow and fill in narrow spaces and long working time enables air displacement
- Rapid, versatile cure processing controlled by temperature