Two-part, translucent, non-flowing, low temperature cure, high strength silicone adhesive.
Uses
Electronic module assembly
IGBT modules
Power supplies and modules
Automotive electrical housings
Industrial and automation
Home appliance electronics
Benefits
Solvent free
Long working time
Excellent primeless adhesion to many substrates
Fast heat cure/low temperature cure
High strength silicone adhesive
Total Solutions for Gen-7 IGBT and SiC Modules
As EVs, solar, and wind technologies generate more power, they also create higher thermal and mechanical demands. Learn about Dow’s Total Solutions for Gen-7 IGBT and SiC modules of high temperatures gels and adhesive offerings.