DOWSIL™ CN-8760 G Thermally Conductive Encapsulant
Two-part, 1 to 1, room temperature and heat curable for manufacturing flexibility, with moderate thermal conductivity.
Properties
These values are not intended for use in preparing specifications.
Typical Properties
- Cure Characteristics Yes No Heat Cure >100C, Room Temperature Extended Working Time > 20 min
- Durometer / Hardness Yes No Medium Stiffness 20A-50A
- One or Two Part Yes No Two Part
- Room Temp Cure Yes No > 24hrs
- Special Characteristics Yes No Mild Thermal Conductivity, UL Recognized
- Special Properties Yes No Thermally Conductive, UL Listed
- Viscosity / Flow Yes No Controlled Flow 3000 - 10,000 cps
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
No sales specification could be found for this material in selected language
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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