Properties
Performance Ratings |
|
---|---|
Adhesion | Medium |
High | High |
Application Benefits |
|
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Feature | Compatible with Low Energy Substrates |
Typical Properties |
|
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Cure Chemistry | Peroxide |
Nonvolatile Content | 60 % |
Shelf Life | 360 Days |
Use | Heat Seal Tapes, Insulation Tapes, Plating Tapes, Splicing Tapes |
Viscosity | 114000 mPa.s |