Properties
Performance Ratings |
|
|---|---|
| Adhesion | Medium |
| High | High |
Application Benefits |
|
|---|---|
| Feature | Compatible with Low Energy Substrates |
Typical Properties |
|
|---|---|
| Cure Chemistry | Peroxide |
| Nonvolatile Content | 60 % |
| Shelf Life | 360 Days |
| Use | Heat Seal Tapes, Insulation Tapes, Plating Tapes, Splicing Tapes |
| Viscosity | 114000 mPa.s |