DOWSIL™ 3-6385 Thermally Conductive Encapsulant Kit

What is DOWSIL™ 3-6385 Thermally Conductive Encapsulant Kit?

Two part, 1:1 mix ratio, red, room temperature or fast heat curing, thermally conductive silicone encapsulant.

Designed to protect against mositure, environmental attack, mechanical and thermal shock as well as vibration especially where heat transfer is important and high hardness or high specific gravity of the product is required
Two part, 1:1 mixing ratio
Room temperature cure or rapid heat cure
Addition cure systems: no cure by-products
Stable and flexible from -50°C to +200°C

Typical Properties
Material Type	Encapsulant / Pottant