DOWSIL™ 1-4174 Thermally Conductive Adhesive

What is DOWSIL™ 1-4174 Thermally Conductive Adhesive?

One-part, gray, 1.8 W/mK thermally conductive adhesive formulated for sealing and bonding components in electronics applications, such as integrated circuits, lids and housings, base plates, and heat sinks. DOWSIL™ 1-4174 Thermally Conductive Adhesive is a heat cure product and is self priming and self leveling.

Uses

Heat dissipation
Sealing
Bonding
Thermal interface material (TIM)

Benefits

Thermal conductivity: 1.8 W/mK
Heat cure: 30 min at 125 °C
Adhesion: 4.5 MPa aluminum lap shear joint
Controlled bond line thickness – 180 µm spacer beads
Non-glass bead version available: DOWSIL™1-4173 Thermally Conductive Adhesive

Properties

Typical Properties
Color	Gray
Cure Type	Heat accelerated cure
Durometer - Shore A	90
Heat Cure	20 min @ 150 °C, 30 min @ 125 °C , 90 min @ 100 °C
Material Type	Adhesive
Number of Parts	1 part
Specific Gravity	2.7
Thermal Conductivity	1.8 W/m・K
Unprimed Adhesion - Lap Shear	4.5 MPa

Materials Training

These videos explain the importance of heat protection in electronics, introduce five types of thermally conductive materials, demonstrate handling and dispensing methods, and offer tips for choosing the best Dow silicone solutions for optimal thermal management.