DOWSIL™ 1-4173 Thermally Conductive Adhesive
One-part gray, flowable thermally conductive adhesive with high tensile strength.
Uses:
- Bonding integrated circuit substrates
- Adhering lids and housings
- Base plate attachment
- Heat sink attachment
Benefits:
- Thermally conductive adhesive
- No added solvents
- 1 part
- Flowable, for self leveling or filling after dispense
- Automated or manual dispensing
- Heat cure with rapid, versatile processing controlled by temperature
- Increases reliability with heat flow away from circuitry components
Properties
These values are not intended for use in preparing specifications.
Typical Properties
- Color Yes No Grey
- Durometer - Shore A Yes No 92
- Flowable Yes No Yes
- Heat Cure Yes No 20 Minutes @ 150 Deg C, 30 Minutes @ 125 Deg C, 90 Minutes @ 100 Deg C
- Linear CTE Yes No 125 um/m/Deg C
- Number of Parts Yes No One Part
- Primerless Adhesion Yes No Yes
- Self Leveling Yes No Yes
- Shear Yes No 650 psi psi
- Thermal Conductivity Yes No 1.8 W/m・K
- Viscosity Yes No 61000 mPa.s
- Water Resistant Yes No Yes
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
No sales specification could be found for this material in selected language
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
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