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DOWSIL™ EG-3896 Kit

Suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Dielectric Constant at 100 kHz 2.9
  • Dielectric Constant at 1MHz 2.9
  • Dielectric Strength 559 volts per mil v/mil
  • Dielectric Strength (kV/mm) 22 kV/mm
  • Dissipation Factor at 100 kHz 4.6e-005
  • Gel Hardness 220 Grams/Penetration (1
  • Heat Cure 30 Minutes @ 70 Deg C, 10 Minutes @ 100 Deg C, 5 Minutes @ 150 Deg C
  • Mixing Viscosity 520 Centipoise
  • Number of Parts Two
  • Temperature Range -40 to 185 °C
  • Volume Resistivity 2e+015 ohm-centimeters
  • Working Time > 240 Minutes

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Please Contact Dow for additional information.

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DOWSIL™ EG-3896 Kit
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ EG-3896 Kit


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DOWSIL™ EG-3896 Kit
Please Contact Dow for distribution options available for this product.