DOWSIL™ TC-5533 Gap Filler

What is DOWSIL™ TC-5533 Gap Filler?

Two-part, blue, 3.0 W/mK thermally conductive gap filler formulated to dissipate heat in electronics applications, such as electric vehicle (EV) battery assembly, EV modules, and power electronics. DOWSIL™ TC-5533 Gap Filler is a low-density product, intended for high volume applications.

Uses

Heat dissipation
Vibration damping
Stress relief
Thermal interface material (TIM)

Benefits

Thermal conductivity: 3.0 W/mK
Room temperature or heat-accelerated cure
Cure time: 24 hr at 25 °C, 1 hr at 125 °C
Hardness: 65 Shore 00
Controlled siloxane volatility (< 100 ppm)
Holds vertical position (cured or uncured state)
Very low stresses during assembly

Battery Gap Filler – DOWSIL™ TC-5533 Thermally Conductive Gap Filler

Dispensing of DOWSIL™ TC-5533 Thermally Conductive Gap Filler for battery applications in cooperation with Graco.

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Properties

Product Use and Formulating
Mixing Ratio	1:1 wt%
Room Temperature Cure	24 Hours

Typical Properties
Color	Blue
Cure Type	Heat accelerated cure, Room temperature cure
Durometer - Shore 00	65
Material Type	Gap Filler
Number of Parts	2 part
Specific Gravity	2.6
Thermal Conductivity	3 W/m・K

Materials Training

These videos explain the importance of heat protection in electronics, introduce five types of thermally conductive materials, demonstrate handling and dispensing methods, and offer tips for choosing the best Dow silicone solutions for optimal thermal management.