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DOW™ Cooling Science
Thermal performance is an evolving discipline, and it's moving fast. Behind every tech breakthrough is expert cooling.
Your partner in more intelligent thermal performance
From AI and advanced computing to electric vehicles (EVs) and telecommunications, thermal management is now a system constraint. Rising power densities and rapid miniaturization across these industries are generating unprecedented thermal pressure.
Thermal materials can no longer be treated as add-ons; they are absolutely critical to system performance, reliability, and sustainability. We partner with leading innovators worldwide to design and build cooling systems that enable next-generation technology.
More Than Materials: What is DOW™ Cooling Science?
Smart cooling science can help you build what hasn’t been built yet. In fast‑moving, high‑performance industries, yesterday’s solutions aren’t always enough for tomorrow’s systems. DOW™ Cooling Science enables faster development cycles and improved system-level performance. We do this by integrating materials innovation, application testing, and co-development capabilities, supported by DOW™ Cooling Science Studios.
Embed thermal materials into front‑end design, reducing redesign and trial‑and‑error.
Validate materials, structure and process together, for faster prototyping and lower development risk.
Balance performance, reliability, cost, manufacturability, and improved sustainability.
Invisible to Essential
Thermal management is the invisible infrastructure supporting our electronic lives, and it’s quickly becoming a defining factor in the limits of electronics performance. This invisible but essential layer supports the cloud and data centers, consumer devices, electronic vehicles, power electronics, aerospace and advanced semiconductors.
Traditional cooling approaches no longer cut it. The industry requires holistic thermal management solutions that span every chip, every device module, and consider the system as a whole. Dow’s cross-vertical expertise allows us to learn across sectors and applications, moving the needle forward across high-performance electronics.
Explore Cooling Science Solutions by Application
Click below to explore more on your application(s) of interest. Dow has cooling solutions across industries, such as AI data centers and servers, advanced semiconductor packaging, automotive and intelligent vehicles, consumer electronics, telecommunications infrastructure, renewable energy, and robotics/embodied intelligence.
Cloud & Data Centers
Manage rising heat loads and power density with advanced TIM materials, liquid and system-level cooling solutions that improve efficiency, reliability, and uptime to support AI, hyperscale infrastructure, and next-gen computing environments.
Consumer Devices
Enable thinner, faster, and more reliable electronics with thermal solutions designed for compact spaces to balance power efficiency, durability, and performance across smartphones, wearables, and everyday devices.
Electric Vehicles
Support battery safety, performance, and longevity with advanced cooling solutions that manage extreme temperatures—helping optimize range, charging speed, and reliability in next-generation EV systems.
Power Electronics
Ensure stable performance in high-power environments with thermal materials that dissipate heat efficiently to support reliability, durability, and performance across renewable energy and industrial power systems.
Aerospace
Deliver dependable thermal performance in extreme conditions with solutions engineered for durability, safety, and efficiency to support advanced avionics, satellites, and aerospace electronics.
Advanced Semiconductor Packaging Solutions
Address heat at the source with precision thermal management for chips and advanced packaging that enable improved performance, reliability, and integration in increasingly dense, high-speed electronic systems.
Explore Cooling Portfolios
Thermal Interface Materials: Gels, greases, gums, CNT‑enhanced pads.
Liquid Cooling (Cold Plate): High‑density data center coolant.
Immersion Cooling: Single‑phase fluid for efficient, low‑carbon infrastructure.
Where tomorrow’s breakthroughs happen today
DOW™ Cooling Science Studios are Dow’s thermal management materials science laboratories connecting materials capability directly with real world system design. We provide a collaborative R&D environment designed to help address growing thermal demands head-on, delivering future-ready materials that help stabilize systems, extend device lifespans, and enable long-term innovation across critical electronics applications. DOW™ Cooling Science Studios can be found worldwide from Shanghai, China to Auburn, Michigan in the United States.
Our cooling solutions combine extensive technical capabilities, global scale, and innovation to enable future-ready data infrastructure that meets the demands of a fast-changing environment.
Validate thermal performance, reliability, and integration before moving to scale. Dow’s application testing platforms simulate real‑world conditions to help reduce risk, optimize designs, and accelerate confident decision‑making.
- In‑application testing to assess thermal performance and system behavior
- Verification and validation across materials, components, and assemblies
- Data‑driven insights to support design refinement and commercialization
Work with Dow experts to accelerate next‑generation thermal solutions, from concept through validation. Our Customer Co‑Creation Center enables early, hands-on collaboration to translate real application needs into materials and system-level solutions that perform in the real world.
- Early collaboration on next‑generation product and system design
- Safe, effective validation in a controlled, customer-focused environment
- Application requirements translated into precise material specifications
Let’s partner on the future of cooling
Not just your materials supplier. Your thermal performance partner. We collaborate with companies across industries and applications who are building the future by helping them think strategically about how to cool it.
DOW™ Cooling Science News & Updates
TIMs Improve Data Center Cooling & Performance
Silicones for optical transceivers improves data center efficiency
Silicones for data center cooling save energy, reduce costs and improve performance
Frequently Asked Questions
DOW™ Cooling Science is a system-level approach to thermal management that brings together materials science, engineering expertise, and collaboration. It focuses on solving heat challenges across the full architecture, from chips, device modules to complete systems, to enable higher performance and long-term reliability.
Traditional models center on selecting and supplying individual materials. DOW™ Cooling Science starts with the system challenge and works backward, aligning materials, design, and performance requirements to deliver more integrated and effective thermal solutions.
As power density increases and systems become more complex, thermal management becomes a limiting factor. DOW™ Cooling Science helps address heat buildup, efficiency loss, reliability risks, and sustainability pressures across a wide range of high-performance environments.
Cooling Science reframes the role of materials within a broader system context. Instead of selecting products in isolation, it connects materials with design and application insight to deliver solutions that perform as intended in real operating conditions.
Early co-creation allows teams to define thermal requirements alongside system design. This alignment helps avoid late-stage compromises, reduces development cycles, and leads to solutions that are better optimized for real-world performance.
Dow’s global Cooling Science Studios are our collaborative environments for testing and development. Customers can evaluate materials, simulate real conditions, and co-develop solutions with experts, supporting everything from early concepts to validation and scale-up. Dow Cooling Science Studios can be found worldwide from Shanghai, China to Auburn in the United States.
DOW™ Cooling Science includes a broad portfolio of thermal interface materials, including gels, greases, gums, gap fillers, encapsulants, and cooling fluids, along with system-level strategies such as liquid and immersion cooling. These solutions are designed to work together to manage heat more effectively.
By addressing thermal challenges early and at a system level, Cooling Science reduces the need for redesigns and overengineering. It also improves energy efficiency, extends system lifespan, and lowers maintenance demands, contributing to reduced total cost of ownership.
Cooling Science supports industries where thermal performance is critical, including cloud and data centers, consumer electronics, electric vehicles, telecommunications, aerospace, and industrial and energy systems.
The ultimate value lies in enabling better-performing systems. By solving thermal challenges holistically, DOW™ Cooling Science helps customers achieve higher efficiency, improved reliability, and greater scalability as technologies continue to evolve.
Keep up with new developments, announcements, and invitations from Dow Cooling Science and the Cooling Science Studio.