Thermally Conductive Gap Filler is a soft and compressible material once cured, 2.5 W/m·K for PCB System Assembly applications, two part material curing at room temperature and 180 micron glass beads.
Uses
DOWSIL™ TC-8225 Thermally Conductive Gap Filler is a thermally conductive material with excellent gap filling characteristics designed to protect and remove heat from PCB system assembly devices
This material is designed for process line integration with automated dispensing meter mix equipment
Benefits
Thermal conductivity: 2.5 W/m.K
Room temperature cure
Long term performance stability during temperature cycling up to 150°C