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  2. DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant

DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant

Two-part, 1 to 1 gray silicone elastomer, heat cure for manufacturing flexibility, thermally conductive encapsulant/pottant for electronics, providing protection from different environmental conditions and thermal management.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Adhesion to Anodized Aluminum
  • Color Grey
  • Dielectric Strength (kV/mm) 24 kV/mm
  • Durometer - Shore A 60 Shore A
  • Elongation 95 %
  • Pot Life 130 Minutes
  • Shelf Life 180 Days
  • Solution Viscosity 2900 Centipoise
  • Specific Gravity 1.67
  • Tensile Strength 370 psi
  • Thermal Conductivity 1 Watts per meter K
  • Viscosity (Part A) 1600 mPa.s
  • Viscosity (Part B) 1900 mPa.s
  • Volume Resistivity 1.08e+015 ohm-centimeters

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DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant


No Regulatory Data Sheets are available for this product

DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant
Please Contact Dow for distribution options available for this product.