DOWSIL™ TC-4525 GB A/B Kit
2成分形、室温硬化熱伝導シリコーンギャップフィラー。熱伝導率:2.5 W/m•K 。柔らかく、圧縮性のある素材。硬化後、プリント回路基板に搭載されている電子部品の熱をヒートシンクに逃がすように設計。車載電子部品用でエンジンやトランスミッションの制御ユニットのようなモジュールを冷却するのに適している。ガラスビーズ(180 μm)配合品も提供可能 。
Uses:
- Battery Gap Fill
- Automotive
Benefits:
- 2.5 W/m∙K thermal conductivity
- Excellent dielectric properties
- Repairable
- Thermal management
- Mechanical protection
- Soft elastomer after cure
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
No sales specification could be found for this material in selected language
The following Rules apply:
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
| Quantity({{ajax.content.bundlePriceData.priceTable.qtyUnitSapName}}) | Unit Price({{ajax.content.bundlePriceData.priceTable.currency}}/{{ajax.content.bundlePriceData.priceTable.sapName}}) |
|---|---|
| {{price.fromQuantity}} + {{price.fromQuantity}} - {{price.toQuantity}} {{price.fromQuantity}} + | {{price.priceData.formattedValue}} |
| Quantity({{ajax.content.bundlePriceData.priceTable.sapName}}) | Unit Price({{ajax.content.bundlePriceData.priceTable.currency}}/{{ajax.content.bundlePriceData.priceTable.sapName}}) |
| 1 + | {{ajax.content.bundlePriceData.priceTable.displayFlatPrice}} |
{{conversions}}
