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DOWSIL™ TC-4525 GB A/B Kit

Thermally Conductive Gap Filler is a soft and compressible material once cured, 2.5 W/m·K for automotive applications, two part material curing at room temperature and 180 micron glass beads.
  • DOWSIL™ TC-4525 A/B

    A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.


  • DOWSIL™ 1-4173 Thermally Conductive Adhesive

    One-part gray, flowable thermally conductive adhesive with high tensile strength.


  • DOWSIL™ EA-6060 Adhesive A&B

     A two-part, non-flowing silicone adhesive enabling assembly production savings due to a fast cure at moderate temperature. 


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Please Contact Dow for additional information.

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DOWSIL™ TC-4525 GB A/B Kit
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ TC-4525 GB A/B Kit


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DOWSIL™ TC-4525 GB A/B Kit
Please Contact Dow for distribution options available for this product.