DOWSIL™ TC-4525 GB A/B Kit
Frequently Bought Together
DOWSIL™ TC-4525 A/B
A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.
DOWSIL™ 1-4173 Thermally Conductive Adhesive
One-part gray, flowable thermally conductive adhesive with high tensile strength.
DOWSIL™ EA-6060 Adhesive A&B
A two-part, non-flowing silicone adhesive enabling assembly production savings due to a fast cure at moderate temperature.
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
Please Contact Dow for additional information.