DOWSIL™ ME-1140 Adhesive Clear
One-part, heat cure, translucent, self-priming adhesive.
Uses:
- Die Attach Adhesive, Globe top encapsulation
- Sealing, encapsulation, adhesive for PCB system assemblies
Benefits:
- Proven excellent jet dispensability which enables:
- Design flexibility with fine, precise patterning
- Ease to optimize parameter for jet dispensing
- Solvent-less, low viscosity
- Well balanced thixo and flow properties
- Low Young's modulus
- Volatile controlled
Properties
These values are not intended for use in preparing specifications.
Typical Properties
- Color Yes No Translucent/Clear
- Cure Characteristics Yes No Heat Cure >100C
- Processing Yes No 1 part
No Safety Data Sheets are available online for this material Please Contact Dow for additional information.
No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.
No Food Contact Letters are available online for this material Please Contact Dow for additional information.
No Food Contact Letters are available online for this material
Please Contact Dow for additional information.
No sales specification could be found for this material in selected language
All products must have the same delivery date
All products must be in the same product family
All products must be purchased on the same order
All products must be shipped from the same plant
Quantity({{ajax.content.bundlePriceData.priceTable.qtyUnitSapName}}) | Unit Price({{ajax.content.bundlePriceData.priceTable.currency}}/{{ajax.content.bundlePriceData.priceTable.sapName}}) |
---|---|
{{price.fromQuantity}} + {{price.fromQuantity}} - {{price.toQuantity}} {{price.fromQuantity}} + | {{price.priceData.formattedValue}} |
Quantity({{ajax.content.bundlePriceData.priceTable.sapName}}) | Unit Price({{ajax.content.bundlePriceData.priceTable.currency}}/{{ajax.content.bundlePriceData.priceTable.sapName}}) |
1 + | {{ajax.content.bundlePriceData.priceTable.displayFlatPrice}} |