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DOWSIL™ TC-5021 Thermally Conductive Compound

Non-curing, thermally conductive silicone paste, low thermal resistance, high thermal conductivity.

Properties

These values are typical properties and are not intended for use in preparing specifications.

  • Adhesion to Metal, Aluminum, Plastic, FR4, Ceramic
  • Color Gray
  • Dielectric Strength 125 volts per mil v/mil
  • Dynamic Viscosity 82650 Centipoise
  • Flowable true
  • Hydrophobic true
  • Low Odor true
  • Number of Parts One
  • Polyesters true
  • Primerless Adhesion Primerless
  • Resistance Type Oxidation Resistance, Ozone Resistance, Solvent Resistance, Thermal Resistance, UV Resistance, Water Resistance
  • Self Leveling true
  • Shelf Life 720 Days
  • Specific Gravity @ 25C 3.5
  • Temperature Range -45 to 200 °C
  • Temperature Stable High, Low
  • Thermal Conductivity 3.3 Watts per meter K
  • Thermal Resistance at 40 psi 0.2 Deg C-cm2/W
  • Volume Resistivity 3.7e+011 ohm-centimeters
  • Water Resistant true

Similar Products

  • DOWSIL™ TC-5351
    Suitable for use as a thermally conductive material in power electronics. It is a one-part grey, and non-curing thermally conductive compound.

No Safety Data Sheets are available online for this material
Please Contact Dow for additional information.

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DOWSIL™ TC-5021 Thermally Conductive Compound
No Technical Data Sheets are available for this product
Please Contact Dow for additional information.

DOWSIL™ TC-5021 Thermally Conductive Compound


No Regulatory Data Sheets are available for this product


DOWSIL™ TC-5021 Thermally Conductive Compound
Please Contact Dow for distribution options available for this product.