物性
アプリケーションの利点 |
|
|---|---|
| Use | Battery Pack, Boards and Assemblies, Components |
製品の使用と処方 |
|
|---|---|
| Cure Type | Addition Cure |
SYLGARD™ 528 Firm Gel Parts A&B
概要
物性
技術資料
サンプル オプション
とは SYLGARD™ 528 Firm Gel Parts A&B?
2 成分形、透明、熱硬化、硬めのゲル。
用途
- Sealing and protecting PCB assemblies
- Especially useful when requiring stronger adhesion or improved dimensional stability
利点
- Heat cure
- Long working time and low viscosity aid process flexibility
- Impregnation may be successful without vacuum
- Mechanical strength
- Long working time for processing flexibility
- Toughened gel for additional mechanical strength