SYL-OFF™ SL 11 Crosslinker

白金触媒水準が非常に低くてもコーティングシステムが形成されるよう設計された無溶剤シリコーン架橋剤。

用途:

Solvent-free
Fast curing
Crosslinker for use with Advantage Series
Enables formulation at very low platinum catalyst levels
Excellent anchorage to many paper substrates, including poly ethylene coated papers
Capable of curing at web temperatures between 100 and 130°C, with adequate dwell times
Low release force values at low peel speed with a slightly inclining release profile at higher speeds
Suitable for lamination with water based acrylic and hot melt adhesives
Good anchorage to many paper substrates
Capable of curing at temperatures between 100 and 130°C, with adequate dwell times
Low release force values at low peel speed with a slightly inclining release profile at higher speeds
Suitable for lamination with water based acrylic adhesives

これらの値は一般特性を表すもので、規格ではありません。

数量 ({{ajax.content.bundlePriceData.priceTable.qtyUnitSapName}})	単価 ({{ajax.content.bundlePriceData.priceTable.currency}}/{{ajax.content.bundlePriceData.priceTable.sapName}})
{{price.fromQuantity}} + {{price.fromQuantity}} - {{price.toQuantity}} {{price.fromQuantity}} +	{{price.priceData.formattedValue}}
数量 ({{ajax.content.bundlePriceData.priceTable.sapName}})	単価 ({{ajax.content.bundlePriceData.priceTable.currency}}/{{ajax.content.bundlePriceData.priceTable.sapName}})
1 +	{{ajax.content.bundlePriceData.priceTable.displayFlatPrice}}