物性
アプリケーションの利点 |
|
|---|---|
| Primerless Adhesion | Primerless |
| Resistance Type | Oxidation Resistance, Ozone Resistance, Thermal Resistance, UV Resistance |
| Use | Boards and Assemblies, Components |
製品の使用と処方 |
|
|---|---|
| Number of Parts | One Part No Mixing |
代表的な物性 |
|
|---|---|
| Adhesion to | Ceramic, FR4, Metal, Plastic |
| Color | Clear |
| Cure Type | UV Cure |
| Dielectric Strength | 425 volts per mil v/mil |
| Opacity | Transparent |
| Penetration after cure | 50 |
| Specific Gravity @ 25°C | 0.99 |
| Thermal Conductivity | 0.15 W/m・K |
| Viscosity | 925 mPa.s |