DOWSIL™ TC-4525 A/B

とは DOWSIL™ TC-4525 A/B?

電子モジュールからの熱をアルミハウジングのようなヒートシンクに導くことで消散させるためのものです。自動車電子や電池パック用途に最適です。

Designed to dissipate the heat from components mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit

Improved reliability in harsh temperatures – Effectively dissipate heat away from sensitive components. They withstand peak exposure at 200°C, and perform reliably at operating temperatures ranging up to 150°C.
Easy processing – These advanced thermally conductive materials dispense easily from their original packaging with minimal to no additional process preparation, making them well-suited for automated application using standard meter mix equipment.
Effective assembly – Avoid slumping on vertical surfaces during assembly. After cure, they maintain their vertical stability even after long use.
Cost-effective, fast cure – The platinum cure system enables fast, controlled cure at room temperature, although cure times can be accelerated further with heat to reduce manufacturing cycle times. No post-cure steps are required.
UL 94 V-0 recognition – Received recognition under Underwriters Laboratories UL 94 standard, which evaluates the flammability of plastic and silicone materials intended for parts in devices and appliances. Recognition under UL 94 is a step toward applying the UL label on your final product.

アプリケーションの利点
Use	Battery Pack, Boards and Assemblies, Components

製品の使用と処方
Number of Parts	Two Part

代表的な物性
Color - Part A	White
Dielectric Constant at 1MHz	6.6
Durometer - Shore 00	55
Heat Cure	10 Minutes @ 80 Deg C, 120 Minutes @ 25 Deg C, 20 Minutes @ 50 Deg C
Material Type	Gap Filler
Shelf Life	300 Days
Specific Gravity	2.9
Thermal Conductivity	2.6 W/m・K
Volume Resistivity	2.4e+014 Ω・cm