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DOWSIL™ TC-3065 Thermal Gel

A one-part, 6.5W/mk thermal conductivity silicone gel. It’s printable or dispensable to cure as a soft thermal gel to replace fabricated thermal pads for thermal transferring, stress relieving and shock damping. Room temperature curing, or accelerated curing at 60°C or higher temperature for shorter curing time.

用途:

  • Telecom devices or equipment, e.g. optical transceivers, ethernet switches, routers, etc.
  • Datacom equipment, e.g. high speed solid-state disks (SSD)

利点:

  • High thermal conductivity (6.5W/mk)
  • Excellent extrusion rate (60 g/min) to support easy auto-dispensing process
  • Resists humidity and other harsh environments without cracking and slumping
  • Ultra low volatile content

物性

これらの値は一般特性を表すもので、規格ではありません。

一般特性

  • ポットライフ はい いいえ 7200 Minutes
  • 伸び はい いいえ 20 %
  • 体積抵抗率 はい いいえ 7 E+13 Ω・cm
  • 品質保証期間 はい いいえ 365 Days
  • 比重 はい いいえ 3.45
  • 熱伝導率 はい いいえ 6.5 W/m・K
  • 硬度ショア00 はい いいえ 50

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DOWSIL™ TC-3065 Thermal Gel
この製品の技術データシートはオンラインでは取得できません
詳細については当社にお問い合わせください

CHOOSE

この製品の法規制データシート(RDS)はオンラインでは取得できません
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DOWSIL™ TC-3065 Thermal Gel
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