物性
アプリケーションの利点 |
|
|---|---|
| Use | Boards and Assemblies, Components, Housings |
代表的な物性 |
|
|---|---|
| Color | Translucent / Clear |
• Protection of electrical assembly applications
• Cure without exotherm at a constant rate
• Require no post cure
• Placed in service immediately following the cure
• 1:1 mix ratio
• Flowable
• Self-priming
• Soft and transparent after cure
• Long working time at RT
• Heat cure
アプリケーションの利点 |
|
|---|---|
| Use | Boards and Assemblies, Components, Housings |
代表的な物性 |
|
|---|---|
| Color | Translucent / Clear |