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DOWSIL™ ME-4139 Encapsulant Dark Grey

1 成分形、ダークグレー、熱硬化、分注によって制御されたチキソトロピー流動性、自己プライミング接着。

用途:

  • Where a semiconductor die has been wire bonded to a flat surface.
  • Where there is a need for a flexible coating
    • wide extremes of temperature, with the use of a pliable epoxy substrate or where severe thermal shocks are encountered
  • Compatible with most semiconductor devices and provides environmental and physical protection of both the chip and interconnecting wires in a single application

利点:

  • High purity
  • Controlled thixotropy and yet flowable as dispensed
  • Optimum coating to cover bonding wires
  • Flexibility over a wide temperature range
  • Excellent dielectric properties
  • Excellent adhesion to ceramic, epoxy and polyimide substrates
  • Protection from moisture, dirt and other contaminants
  • One-part elastomer with fast heat cure

物性

これらの値は一般特性を表すもので、規格ではありません。

一般特性

  • カラー はい いいえ ダークグレー
  • 動粘度 はい いいえ 45000 Centipoise
  • 比重(25℃) はい いいえ 1.15
  • 熱硬化 はい いいえ 60 Minutes @ 150 Deg C
  • 硬度ショアA はい いいえ 28 Shore A
  • 1液 または 2液 はい いいえ 1

この製品の有効な安全データシート(SDS)がありません
詳細については当社にお問い合わせください

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選択された言語での当該製品の販売規格は見つかりません

DOWSIL™ ME-4139 Encapsulant Dark Grey
この製品の技術データシートはオンラインでは取得できません
詳細については当社にお問い合わせください

CHOOSE

この製品の法規制データシート(RDS)はオンラインでは取得できません
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DOWSIL™ ME-4139 Encapsulant Dark Grey
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